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CLRC63201T/0FE Datasheet(PDF) 160 Page - NXP Semiconductors |
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CLRC63201T/0FE Datasheet(HTML) 160 Page - NXP Semiconductors |
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160 / 163 page ![]() Philips Semiconductors Product Specification Rev. 3.0; May 2003 Multiple Protocol Contactless Reader IC CL RC632 160 Confidential 25 PACKAGE OUTLINES 25.1 SO32 UNIT A max. A1 A2 A3 bp cD(1) E(1) eHE LLp QZ y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm inches 2.65 0.10 0.25 0.01 1.4 0.055 0.3 0.1 2.45 2.25 0.49 0.36 0.27 0.18 20.7 20.3 7.6 7.4 1.27 10.65 10.00 1.2 1.0 0.95 0.55 8 0 o o 0.25 0.1 0.004 0.25 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.1 0.4 SOT287-1 (1) 0.012 0.004 0.096 0.086 0.02 0.01 0.050 0.047 0.039 0.419 0.394 0.30 0.29 0.81 0.80 0.011 0.007 0.037 0.022 0.01 0.01 0.043 0.016 w M bp D HE Z e c v M A X A y 32 17 16 1 θ A A1 A2 Lp Q detail X L (A ) 3 E pin 1 index 0 5 10 mm scale SO32: plastic small outline package; 32 leads; body width 7.5 mm SOT287-1 95-01-25 97-05-22 Figure 255-1: Outline and Dimension of CL RC632 in SO32 |
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