DRV8876PWPR datasheet(26/51 Pages) TI2

26 / 51 page

Pulse duration (s)

0.0005

0.002

0.005 0.01 0.02

0.05

0.1

0.2 0.3 0.5

3 4 5 67 10

20 30

50 70100

200

500 1000

0.5

0.7

100

200

1oz_

2 cm^2, 2-layer

4 cm^2, 2-layer

8 cm^2, 2-layer

16 cm^2, 2-layer

4-layer

Pulse duration (s)

0.001 0.002

0.005 0.01

0.02

0.05

0.1

0.2 0.3 0.50.7 1

3 4 5 6 78 10

20 30

50 70 100

200300 500

1000

0.5

0.7

100

2oz_

4 cm^2, 4-layer

8 cm^2, 4-layer

16 cm^2, 4-layer

4 cm^2, 2-layer

8 cm^2, 2-layer

16 cm^2, 2-layer

DRV8876

SLVSDS7B – AUGUST 2019 – REVISED NOVEMBER 2019

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Figure 28. HTSSOP package Junction-to-ambient thermal impedance for 2-oz copper layouts

Figure 29 and Figure 30 show the transient thermal performance for the VQFN package with 2-layer and 4-layer

PCB layouts. For this simulation, only the bottom layer was varied for the 2-layer case because the pins of the

VQFN package constrain the copper area under the chip on the top layer.

Figure 29. VQFN package junction-to-ambient thermal impedance for 1-oz copper layouts

DRV8876PWPR Datasheet(PDF) 26 Page - Texas Instruments

DRV8876PWPR Datasheet(HTML) 26 Page - Texas Instruments

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