AT24C01D datasheet(17/26 Pages) ATMEL

17 / 26 page

AT24C01D and AT24C02D [DATASHEET]

Atmel-8871B-SEEPROM-AT24C01D-02D-Datasheet_032014

10.

Ordering Information

Notes: 1.

T = Tape and reel:



SOIC = 4K units per reel



TSSOP, UDFN, and SOT23 = 5K units per reel

B = Bulk



SOIC and TSSOP = 100 units per tube



PDIP = 50 units per tube

For wafer sales, please contact Atmel Sales.

Atmel Ordering Code

Lead Finish

Package

Voltage

Operation Range

AT24C01D-SSHM-T(1)

NiPdAu

(Lead-free/Halogen-free)

8S1

1.7V to 3.6V

Industrial Temperature

(–40

C to 85C)

AT24C01D-SSHM-B(2)

AT24C01D-XHM-T(1)

AT24C01D-XHM-B(2)

AT24C01D-MAHM-T(1)

8MA2

AT24C01D-PUM

Matte Tin

(Lead-free/Halogen-free)

8P3

AT24C01D-STUM-T(1)

5TS1

AT24C01D-CUM-T(1)

SnAgCu Ball

(Lead-free/Halogen-free)

8U3-1

AT24C01D-WWU11M(3)

N/A

Wafer Sale

AT24C02D-SSHM-T(1)

NiPdAu

(Lead-free/Halogen-free)

8S1

1.7V to 3.6V

Industrial Temperature

(–40

C to 85C)

AT24C02D-SSHM-B(2)

AT24C02D-XHM-T(1)

AT24C02D-XHM-B(2)

AT24C02D-MAHM-T(1)

8MA2

AT24C02D-PUM

Matte Tin

(Lead-free/Halogen-free)

8P3

AT24C02D-STUM-T(1)

5TS1

AT24C02D-CUM-T(1)

SnAgCu Ball

(Lead-free/Halogen-free)

8U3-1

AT24C02D-WWU11M(3)

N/A

Wafer Sale

Package Type

8S1

8-lead, 0.15” wide, Plastic Gull Wing Small Outline (JEDEC SOIC)

8-lead, 4.40mm body, Plastic Thin Shrink Small Outline Package (TSSOP)

8MA2

8-pad, 2.00mm x 3.00mm body, 0.50mm Pitch, Ultra Thin Dual Flat No Lead (UDFN)

8P3

8-lead, 0.30” wide, Plastic Dual Inline Package (PDIP)

5TS1

5-lead, 2.90mm x 1.60mm body, Plastic Thin Shrink Small Outline (SOT23)

8U3-1

8-ball, 1.50mm x 2.00mm body, 0.5mm pitch, Very thin Fine Ball Grid Array (VFBGA)

AT24C01D Datasheet(PDF) 17 Page - ATMEL Corporation

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