AN3077 datasheet(69/82 Pages) STMICROELECTRONICS

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AN3077

I/O pin/ball configuration

Mandatory: The user must avoid configurations that place redundant signals on

neighboring pads or pins.

Whether two functions on two package pins/balls are adjacent to each other can easily be

determined by looking at the mechanical drawings of the packages (see the

Device_Number Data Sheet) together with the pin/spheres (balls) number information of the

packages as seen in the Device_Number Reference Manuals “System Integration Unit Lite

(SIUL)” section and the “Pin muxing” table.

The internal die pad sequence can be derived from the package pin sequence of the

QFP144 pin package shown in the Device_Number Data Sheet.

Figure 17. Example of QFP144 pin/pad adjacency

For example, the internal die pads supporting the functionality described in Figure 17 are

referred to by “Port Pin” in the first column. From this figure you can see that the port pins

are B[9] and B[10]. Since these two port pins are in sequential order on the same port (Port

B) the die pads are adjacent to each other. The corresponding two QFP144 package pin

numbers are directly adjacent to each other, QFP144 pins 52 and 53. In general, the internal

die pads follow the same sequence as the corresponding package pins for QFP144

packages. If pins on the QFP144 pins are adjacent to each other, the corresponding internal

die pads are also adjacent. Likewise, if package pins are not adjacent to each other the

corresponding die pads are also not adjacent.

An example on the BGA package as shown in Figure 18 has two balls belonging to port pins

B[9] and B[10], which are balls U7 and R8, respectively. They are not directly adjacent to

each other on the BGA package. However, their corresponding die pads are adjacent to

AN3077 Datasheet(PDF) 69 Page - STMicroelectronics