UCS1002-3 datasheet(4/114 Pages) MICROCHIP

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UCS1002-3

DS20006852A-page 4

 2023 Microchip Technology Inc. and its subsidiaries

1.0

ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings†

Voltage on VDD, VS and VBUS pins ...............................................................................................................-0.3 to +6V

Pull-Up Voltage (VPULLUP) ..................................................................................................................-0.3 to VDD + 0.3V

Data Switch Current (IHSW_ON), Switch On ..........................................................................................................±50 mA

Port Power Switch Current ..................................................................................................................... Internally limited

Data Switch Pin Voltage To Ground (DPOUT, DPIN, DMOUT, DMIN);

(VDD powered or unpowered) ............................................................................................................ -0.3 to VDD + 0.3V

Differential Voltage Across Open Data Switch (DPOUT-DPIN, DMOUT-DMIN, DPIN-DPOUT, DMIN-DMOUT).......VDD

Voltage on any Other Pin to Ground .................................................................................................. -0.3 to VDD + 0.3V

Current on any Other Pin ......................................................................................................................................±10 mA

Package Power Dissipation ............................................................................................................................... Table 1-1

Operating Ambient Temperature Range..................................................................................................-40°C to +125°C

Storage Temperature Range...................................................................................................................-55°C to +150°C

†Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at those or any other conditions

above those indicated in the operation listings of this specification is not implied. Exposure to maximum

rating conditions for extended periods may affect device reliability.

TABLE 1-1:

POWER DISSIPATION SUMMARY

Board

Package

JC

JA

Derating

Factor Above

+25°C

TA <+25°C

Power

Rating

TA < +70°C

Power

Rating

TA <+85°C

Power

Rating

High K

(see Note 1)

20-pin QFN

4x4 mm

6°C/W

41°C/W

24.4 mW°/C

2193 mW

1095 mW

729 mW

Low K

(see Note 1)

20-pin QFN

4x4 mm

6°C/W

60°C/W

16.67 mW°/C

1498 mW

748 mW

498 mW

Note 1: A High K board uses a thermal via design with the thermal landing soldered to the PCB ground plane with

0.3 mm (12 mil) diameter vias in a 3x3 matrix (9 total) at 0.5 mm (20 mil) pitch. The board is multi-layer

with 1-ounce internal power and ground planes and 2-ounce copper traces on top and bottom. A Low K

board is a two layer board without thermal via design with 2-ounce copper traces on the top and bottom.

TABLE 1-2:

ELECTRICAL CHARACTERISTICS

Electrical Characteristics: Unless otherwise specified, VDD = 4.5V to 5.5V, VS = 2.9V to 5.5V, VPULLUP = 3V to 5.5V,

TA = -40°C to +85°C; all Typical values at VDD = VS = 5V, TA = +27°C.

Parameter

Sym.

Min.

Typ.

Max.

Unit

Conditions

Power and Interrupts - DC

Supply Voltage

VDD

4.5

5.5

Note 1

Source Voltage

2.9

5.5

Note 1

Supply Current in Active

(IDD_ACTIVE + IVS_ACT)

IACTIVE

—

650

750

µA

Average current IBUS = 0 mA

Supply Current in Sleep

(IDD_SLEEP + IVS_SLEEP)

ISLEEP

—

µA

Average current

VPULLUP  VDD

Note 1: For split supply systems using the Attach Detection feature, VS must not exceed VDD + 150 mV.

2: The current measurement full-scale range maximum value is 2.5A. However, the UCS1002-3 cannot

report values above ILIM (if IBUS_R2MIN  ILIM) or above IBUS_R2MIN (if IBUS_R2MIN > ILIM and ILIM 1.5A).

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