XCVU29P datasheet(3/68 Pages) AMD

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Table 1: Absolute Maximum Ratings (cont'd)

Symbol

Description1

Min

Max

Units

Maximum junction temperature for XCVU31P, XCVU33P, XCVU35P,

XCVU37P

–

120

°C

Maximum junction temperature for all other devices

–

125

°C

Notes:

Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not

implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time might affect device reliability.

VCCINT_IO must be connected to VCCBRAM.

VCCAUX_IO must be connected to VCCAUX.

The lower absolute voltage specification always applies.

For I/O operation, see the UltraScale Architecture SelectIO Resources User Guide (UG571).

When operating outside of the recommended operating conditions, refer to Table 4 for maximum overshoot and undershoot

specifications.

For more information on supported GTY transceiver terminations see the UltraScale Architecture GTY Transceivers User Guide (UG578) or

Virtex UltraScale+ FPGAs GTM Transceivers User Guide (UG581).

AC coupled operation is not supported for RX termination = floating.

For GTY transceivers, DC coupled operation is not supported for RX termination = GND.

10. DC coupled operation is not supported for RX termination = programmable.

11. For soldering guidelines and thermal considerations, see the UltraScale and UltraScale+ FPGAs Packaging and Pinouts Product Specification

(UG575).

12. For devices with high-bandwidth memory (HBM), the storage temperature is the case surface temperature on the center/top side of the

device. For the measurement conditions, refer to the JESD51-2 standard.

Recommended Operating Conditions

Table 2: Recommended Operating Conditions

Symbol

Description1, 2

Min

Typ

Max

Units

FPGA Logic

VCCINT

Internal supply voltage

0.825

0.850

0.876

For -2LE (VCCINT = 0.72V) devices: internal supply voltage

0.698

0.720

0.742

For -3E devices: internal supply voltage

0.873

0.900

0.927

VCCINT_IO3

Internal supply voltage for the I/O banks

0.825

0.850

0.876

For -2LE (VCCINT = 0.72V) devices: internal supply voltage for the

I/O banks

0.825

0.850

0.876

For -3E devices: internal supply voltage for the I/O banks

0.873

0.900

0.927

VCCBRAM

Block RAM supply voltage

0.825

0.850

0.876

For -3E devices: block RAM supply voltage

0.873

0.900

0.927

VCCAUX

Auxiliary supply voltage

1.746

1.800

1.854

VCCO4, 5

Supply voltage for I/O banks

0.950

–

1.900

VCCAUX_IO6

Auxiliary I/O supply voltage

1.746

1.800

1.854

VIN7

I/O input voltage

–0.200

–

VCCO + 0.200

IIN8

Maximum current through any pin in a powered or unpowered

bank when forward biasing the clamp diode

–

VBATT9

Battery voltage

1.000

–

1.890

High Bandwidth Memory

VCC_HBM

Supply voltage for the high-bandwidth memory (HBM)

1.164

1.200

1.236

Virtex UltraScale+ FPGA Data Sheet: DC and AC Switching Characteristics

DS923 (v1.10) April 26, 2019

www.xilinx.com

Product Specification

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