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OMAP3530-HiRel Datasheet(PDF) 7 Page - Texas Instruments |
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OMAP3530-HiRel Datasheet(HTML) 7 Page - Texas Instruments |
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7 / 239 page ![]() Contents OMAP3525-HiRel and OMAP3530-HiRel Applications Processors www.ti.com SPRS599 – JUNE 2009 1 OMAP3525-HiRel and OMAP3530-HiRel 4.2 Output Clock Specifications ........................ 113 Applications Processors ............................... 1 4.3 DPLL and DLL Specifications ...................... 115 1.1 Features .............................................. 1 5 VIDEO DAC SPECIFICATIONS ..................... 122 1.2 SUPPORTS DEFENSE, AEROSPACE, AND 5.1 Interface Description ............................... 122 MEDICAL APPLICATIONS ........................... 3 5.2 Electrical Specifications Over Recommended 1.3 Description ............................................ 4 Operating Conditions .............................. 124 1.4 Functional Block Diagram ............................ 6 5.3 Analog Supply (vdda_dac) Noise Requirements .. 126 2 TERMINAL DESCRIPTION .............................. 8 5.4 External Component Value Choice ................ 127 2.1 Terminal Assignment ................................. 8 6 TIMING REQUIREMENTS AND SWITCHING 2.2 Ball Characteristics .................................. 12 CHARACTERISTICS .................................. 128 2.3 Multiplexing Characteristics ......................... 50 6.1 Timing Test Conditions ............................ 128 2.4 Signal Description ................................... 66 6.2 Interface Clock Specifications ..................... 128 3 ELECTRICAL CHARACTERISTICS .................. 93 6.3 Timing Parameters ................................. 129 3.1 Power Domains ..................................... 93 6.4 External Memory Interfaces ........................ 130 3.2 Absolute Maximum Ratings ......................... 95 6.5 Video Interfaces .................................... 159 3.3 Recommended Operating Conditions ............... 97 6.6 Serial Communications Interfaces ................. 179 3.4 DC Electrical Characteristics ........................ 99 6.7 Removable Media Interfaces ...................... 212 3.5 Core Voltage Decoupling .......................... 102 6.8 Test Interfaces ..................................... 227 3.6 Power-up and Power-down ........................ 104 7 PACKAGE CHARACTERISTICS .................... 233 4 CLOCK SPECIFICATIONS ........................... 107 7.1 Package Thermal Resistance ...................... 233 4.1 Input Clock Specifications ......................... 108 7.2 Device Support ..................................... 233 Submit Documentation Feedback Contents 7 |
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