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OMAP3530-HiRel Datasheet(PDF) 7 Page - Texas Instruments

Part # OMAP3530-HiRel
Description  OMAP3525-HiRel and OMAP3530-HiRel Applications Processors
PDF  239 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
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OMAP3530-HiRel Datasheet(HTML) 7 Page - Texas Instruments

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Contents
OMAP3525-HiRel and OMAP3530-HiRel Applications Processors
www.ti.com
SPRS599 – JUNE 2009
1
OMAP3525-HiRel and OMAP3530-HiRel
4.2
Output Clock Specifications
........................ 113
Applications Processors
............................... 1
4.3
DPLL and DLL Specifications
...................... 115
1.1
Features
.............................................. 1
5
VIDEO DAC SPECIFICATIONS
..................... 122
1.2
SUPPORTS DEFENSE, AEROSPACE, AND
5.1
Interface Description
............................... 122
MEDICAL APPLICATIONS
........................... 3
5.2
Electrical Specifications Over Recommended
1.3
Description
............................................ 4
Operating Conditions
.............................. 124
1.4
Functional Block Diagram
............................ 6
5.3
Analog Supply (vdda_dac) Noise Requirements
.. 126
2
TERMINAL DESCRIPTION
.............................. 8
5.4
External Component Value Choice
................ 127
2.1
Terminal Assignment
................................. 8
6
TIMING REQUIREMENTS AND SWITCHING
2.2
Ball Characteristics
.................................. 12
CHARACTERISTICS
.................................. 128
2.3
Multiplexing Characteristics
......................... 50
6.1
Timing Test Conditions
............................ 128
2.4
Signal Description
................................... 66
6.2
Interface Clock Specifications
..................... 128
3
ELECTRICAL CHARACTERISTICS
.................. 93
6.3
Timing Parameters
................................. 129
3.1
Power Domains
..................................... 93
6.4
External Memory Interfaces
........................ 130
3.2
Absolute Maximum Ratings
......................... 95
6.5
Video Interfaces
.................................... 159
3.3
Recommended Operating Conditions
............... 97
6.6
Serial Communications Interfaces
................. 179
3.4
DC Electrical Characteristics
........................ 99
6.7
Removable Media Interfaces
...................... 212
3.5
Core Voltage Decoupling
.......................... 102
6.8
Test Interfaces
..................................... 227
3.6
Power-up and Power-down
........................ 104
7
PACKAGE CHARACTERISTICS
.................... 233
4
CLOCK SPECIFICATIONS
........................... 107
7.1
Package Thermal Resistance
...................... 233
4.1
Input Clock Specifications
......................... 108
7.2
Device Support
..................................... 233
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Contents
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