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OMAP3530-HiRel Datasheet(PDF) 98 Page - Texas Instruments

Part # OMAP3530-HiRel
Description  OMAP3525-HiRel and OMAP3530-HiRel Applications Processors
PDF  239 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

OMAP3530-HiRel Datasheet(HTML) 98 Page - Texas Instruments

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OMAP3525-HiRel and OMAP3530-HiRel Applications Processors
SPRS599 – JUNE 2009
www.ti.com
Table 3-3. Recommended Operating Conditions (continued)
PARAMETER
DESCRIPTION
MIN
NOM
MAX
UNIT
vdds_sram
SRAM LDOs
1.71
1.8
1.89
V
Noise (peak-peak)
50
mVpp
vdds_dpll_per
Peripherals DPLLs power supply
1.71
1.8
1.89
V
Noise (peak-peak)
36
mVpp
vdds_dpll_dll
Supply voltage for DPLLs I/Os
1.71
1.8
1.89
V
Noise (peak-peak)
30
mVpp
vdds_csi2
VDDS for serial camera interface
1.71
1.8
1.89
V
Noise (peak-peak)
25
mVpp
vdds_csib
VDDS for serial camera interface
1.71
1.8
1.89
V
Noise (peak-peak) for a frequency from dc to 10 MHz
20
mVpp
vdds_sdi
Dedicated VDDS for SDI IO cell
1.71
1.8
1.89
V
Noise (peak-peak)
20
mVpp
vdds_dsi
1.8-V analog supply pad for the module
1.71
1.8
1.89
V
Noise (peak-peak)
For a frequency from 0
50
mVpp
to 10 MHz
For any frequency > 400
2.5
MHz
vpp(2)
eFuse programming
V
vss
Ground
0
0
0
V
vssa_dac
Dedicated ground for DAC
0
0
0
V
TJ
Operating junction temperature(3)
-40
-
90
°C
(2)
It is recommended not to connect this pin. It is just used for eFuse programming on package unit.
(3)
For proper device operation, Tj must be within the specified range.
ELECTRICAL CHARACTERISTICS
98
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