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OMAP3530-HiRel Datasheet(PDF) 91 Page - Texas Instruments

Part # OMAP3530-HiRel
Description  OMAP3525-HiRel and OMAP3530-HiRel Applications Processors
PDF  239 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

OMAP3530-HiRel Datasheet(HTML) 91 Page - Texas Instruments

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2.4.9
System and Miscellaneous Terminals
OMAP3525-HiRel and OMAP3530-HiRel Applications Processors
www.ti.com
SPRS599 – JUNE 2009
Table 2-27. System and Miscellaneous Signals Description
SIGNAL NAME
DESCRIPTION
TYPE(1)
BALL
BALL TOP
BALL
BALL TOP
BOTTOM
(CBB Pkg.)
BOTTOM
(CBC Pkg.)
(CBB Pkg.)
(CBC Pkg.)
sys_32k
32-kHz clock input
I
AE25
NA
AE20
-
sys_xtalin
Main input clock. Oscillator input or LVCMOS at
I
AE17
NA
AF19
-
19.2, 13, or 12 MHz.
sys_xtalout
Output of oscillator
O
AF17
NA
AF20
-
sys_altclk
Alternate clock source selectable for GPTIMERs
I
J25
NA
J23
-
(maximum 54 MHz), USB (48 MHz), or
NTSC/PAL (54 MHz)
sys_clkreq
Request from OMAP3525/30 device for system
IO
AF25
NA
W15
-
clock (open source type)
sys_clkout1
Configurable output clock1
O
AG25
NA
AE14
-
sys_clkout2
Configurable output clock2
O
AE22
NA
W11
-
sys_boot0
Boot configuration mode bit 0
I
AH26
NA
F3
-
sys_boot1
Boot configuration mode bit 1
I
AG26
NA
D3
-
sys_boot2
Boot configuration mode bit 2
I
AE14
NA
C3
-
sys_boot3
Boot configuration mode bit 3
I
AF18
NA
E3
-
sys_boot4
Boot configuration mode bit 4
I
AF19
NA
E4
-
sys_boot5
Boot configuration mode bit 5
I
AE21
NA
G3
-
sys_boot6
Boot configuration mode bit 6
I
AF21
NA
D4
-
sys_nrespwron
Power On Reset
I
AH25
NA
V13
-
sys_nreswarm
Warm Boot Reset (open drain output)
IOD
AF24
NA
AD7
-
sys_nirq
External FIQ input
I
AF26
NA
V16
-
sys_nvmode1
Indicates the voltage mode
O
AD26
NA
AD15
-
sys_nvmode2
Indicates the voltage mode
O
AE26
NA
W16
-
sys_off_mode
Indicates the voltage mode
O
AF22
NA
V12
-
sys_ndmareq0
External DMA request 0 (system expansion).
I
U8
NA
B6
-
Level (active low) or edge (falling) selectable.
sys_ndmareq1
External DMA request 1 (system expansion).
I
T8 / J8
NA
B4 / C6
-
Level (active low) or edge (falling) selectable.
sys_ndmareq2
External DMA request 2 (system expansion).
I
L3 / R8
NA
D1 / C4
-
Level (active low) or edge (falling) selectable.
sys_ndmareq3
External DMA request 3 (system expansion).
I
K3 / P8
NA
D2 / B5
-
Level (active low) or edge (falling) selectable.
sys_secure_
MSECURE transactions indicator
O
AG9
NA
V2
-
indicator
sys_drm_
MSECURE output
O
AF9
NA
AA4
-
msecure
sys_ipmcsws(2)
Reserved
AI
B1
NA
B1
-
sys_opmcsws(2)
Reserved
AO
A1
NA
A2
-
pop_int0_ft(3)
POP dedicated control signal
O
AG11
AB9
AF10
Y9
pop_int1_ft(3)
POP dedicated control signal
O
AH11
AC9
AE2
W2
pop_tq_temp_
POP dedicated control signal
NA
AH16
AC14
AF14
AA12
sense_ft(3)
(1)
Type = Ball type for this specific function (I = Input, O = Output, Z = high-impedance, D = Open Drain, DS = Differential, A = Analog)
(2)
sys_ipmcsws and sys_opmcsws pins must be left unconnected.
(3)
Top feed-through pop_int0_ft, pop_int1_ft are routed as feed-through for loopback to a GPIO to detect the POP OneNAND die event
and respond accordingly. Top pop_tq_temp_sense_ft is routed as feed-through for loopback to a GPIO to monitor the temperature of the
POP DDR. Top pop_reset_rp_ft is typically looped back to sys_nreswarm to reset the flash memories when a warm reset event occurs
on the processor side.
Submit Documentation Feedback
TERMINAL DESCRIPTION
91



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