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OMAP3530-HiRel Datasheet(PDF) 96 Page - Texas Instruments

Part # OMAP3530-HiRel
Description  OMAP3525-HiRel and OMAP3530-HiRel Applications Processors
PDF  239 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

OMAP3530-HiRel Datasheet(HTML) 96 Page - Texas Instruments

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OMAP3525-HiRel and OMAP3530-HiRel Applications Processors
SPRS599 – JUNE 2009
www.ti.com
This section includes the maximum power consumption for each power domain (core, IVA2, etc.).
Table 3-2 summarizes the power consumption at the ball level.
Table 3-2. Estimated Maximum Power Consumption At Ball Level
PARAMETER
MAX
MAX
UNIT
( T = 90
°C)
( T = 105
°C)
Signal
Description
＝
vdd_mpu_iva
Processors
OMAP3525/30 (SmartReflex™ Enabled)
1137
1209
mA
OMAP35=25/30 (SmartReflex™
1384
1520
mA
Disabled)
vdd_core
Core
OMAP3530 (SmartReflex™ Enabled)
433
490
mA
OMAP3530 (SmartReflex™ Disabled)
509
599
mA
OMAP3525 (SmartReflex™ Enabled)
328
382
mA
OMAP3525(SmartReflex™ Disabled)
378
485
mA
vdd_core
Core
OMAP3515 (SmartReflex™ Enabled)
433
490
mA
OMAP3515 (SmartReflex™ Disabled)
509
599
mA
OMAP3503 (SmartReflex™ Enabled)
328
382
mA
OMAP3503(SmartReflex™ Disabled)
378
485
mA
vdda_dac
Video DAC
65
65
mA
vdss_dpll_dll
DLL + DPLL MPU, DSP, and core
25
25
mA
vdds_dpll_per
DPLL peripheral 1 and peripheral 2
15
15
mA
mA
vdds_sram
Processors and core LDO (LDO1 and LDO2)
41
41
mA
vdds_wkup_bg
Bandgap, wakeup + LDO, EMU off
6
6
mA
vdds_mem
Standard I/Os (SDRC+GPMC)
37
37
vdds
Standard I/Os (all excluding SDRC and GPMC)
63
63
mA
vdds_mmc1
MMC I/O(1)
20
20
mA
vdds_mmc1a
Power supply for MMC IO [DAT4 – DAT7]
2
2
mA
vpp
eFuse
50
50
mA
(1)
MMC card and I/O card are not included.
ELECTRICAL CHARACTERISTICS
96
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