LPC4370 datasheet(86/150 Pages) NXP

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LPC4370

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Product data sheet

Rev. 2 — 21 October 2013

86 of 150

NXP Semiconductors

LPC4370

32-bit ARM Cortex-M4/M0 microcontroller

Thermal characteristics

The average chip junction temperature, Tj (C), can be calculated using the following

equation:

(1)

• Tamb = ambient temperature (C),

• Rth(j-a) = the package junction-to-ambient thermal resistance (C/W)

• PD = sum of internal and I/O power dissipation

The internal power dissipation is the product of IDD and VDD. The I/O power dissipation of

the I/O pins is often small and many times can be negligible. However it can be significant

in some applications.

amb

th j

–







Table 8.

Thermal characteristics

VDD = 2.2 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified;

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Tj(max)

maximum junction

temperature

--125

C

Table 9.

Thermal resistance value (BGA package)

Symbol

Parameter

Conditions

Thermal resistance in

C/W ±15 %

LBGA256

TFBGA100

Rth(j-a)

thermal resistance from

junction to ambient

JEDEC (4.5 in

 4 in); still air 29

8-layer (4.5 in

 3 in); still air 24

Rth(j-c)

thermal resistance from

junction to case

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