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MAX3286C/D Datasheet(PDF) 18 Page - Maxim Integrated Products

Part # MAX3286C/D
Description  3.0V to 5.5V, 1.25Gbps/2.5Gbps LAN Laser Drivers
PDF  28 Pages
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Manufacturer  MAXIM [Maxim Integrated Products]
Direct Link  https://www.maximintegrated.com/en.html
Logo MAXIM - Maxim Integrated Products

MAX3286C/D Datasheet(HTML) 18 Page - Maxim Integrated Products

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3.0V to 5.5V, 1.25Gbps/2.5Gbps
LAN Laser Drivers
18
______________________________________________________________________________________
The modulator is not needed. Leave TC and MODSET
open. Connect IN+ to VCC, IN- to REF, and leave OUT+
and OUT– open.
Wirebonding Die
The MAX3286/MAX3296 series uses bondpads with gold
metalization. Make connections to the die with gold wire
only, using ball-bonding techniques. Wedge bonding is
not recommended. Bondpad size is 4 mil square. Die
thickness is typically 15 mils (0.38mm).
Interface Models
Figures 14–18 show typical input/output models for the
MAX3286/MAX3296 series of laser drivers. If dice are
used, replace the package parasitic elements with
bondwire parasitic elements.
4kΩ
2.5kΩ
VCC
FAULT, FAULT, POR
MAX3286
MAX3296
Figure 14. Logic Outputs
10kΩ
550Ω
60Ω
VCC
SHDNDRV
MAX3286
MAX3296
Figure 15. SHDNDRV Output
PACKAGE
VCC
VCC
1.5nH
OUT-
0.2pF
1.5nH
0.2pF
OUT+
50Ω
50Ω
PACKAGE
1pF
1pF
Figure 16. Modulator Outputs



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