MB9B360R datasheet(158/166 Pages) CYPRESS

158 / 166 page

Document Number: 002-04872 Rev.*A

Page 158 of 166

MB9B360R Series

100-pin plastic QFP

Lead pitch

0.65 mm

Package width ×

package length

14.00 mm × 20.00 mm

Lead shape

Gullwing

Sealing method

Plastic mold

Mounting height

3.35 mm MAX

Code

(Reference)

P-QFP100-14 × 20-0.65

100-pin plastic QFP

(FPT-100P-M36)

2011 FUJITSU SEMICONDUCTOR LIMITED HMbF100-36Sc-1-1

100

20.00±0.20(.787±.008)

23.90±0.40(.941±.016)

(.551±.008)

17.90± 0.40

(.705±.016)

INDEX

0.65(.026)

0.32 ± 0.05

(.013±.002)

0.13(.005)

"A"

0.17 ± 0.06

(.007 ±. 002)

0.10(.004)

Details of "A" part

(.035 ±. 006)

0.88 ± 0.15

(.031 ±. 008)

0.80 ± 0.20

0.25(.010)

3.00

+0.35

–0.20

+.014

–.008

.118

(Mounting height)

0.25 ± 0.20

(.010 ±. 008)

(Stand off)

0~8°

*14.00±0.20

Dimensions in mm (inches).

Note: The valuesin parentheses are reference values.

Note 1) * : These dimensions do not include resin protrusion.

Note 2) Pins width and pins thickness include plating thickness.

Note 3) Pins width do not include tie bar cutting remainder.

MB9B360R Datasheet(PDF) 158 Page - Cypress Semiconductor

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