MB9B360R datasheet(157/166 Pages) CYPRESS

157 / 166 page

Document Number: 002-04872 Rev.*A

Page 157 of 166

MB9B360R Series

100-pin plastic LQFP

Lead pitch

0.50 mm

Package width ×

package length

14.00 mm × 14.00 mm

Lead shape

Gullwing

Lead bend

direction

Normal bend

Sealing method

Plastic mold

Mounting height

1.70 mm MAX

Weight

0.65 g

100-pin plastic LQFP

(FPT-100P-M23)

2009-2010 FUJITSU SEMICONDUCTOR LIMITED F100034S-c-3-4

16.00±0.20(.630±.008)SQ

100

0.50(.020)

0.22±0.05

0.08(.003)

*14.00±0.10(.551±.004)SQ

0.145±0.055

(.006±.002)

0.08(.003)

"A"

INDEX

0°~8°

0.50±0.20

0.10±0.10

(Stand off)

+.008

+0.20

(Mounting height)

- 0.10

1.50

.059 -.004

(

)

0.60±0.15

0.25(.010)

Dimensions in mm (inches).

Note:The values in parentheses are reference values.

Note 1) * : These dimensions do not include resin protrusion.

Note 2) Pins width and pins thickness include plating thickness.

Note 3) Pins width do not include tie bar cutting remainder.

Details of "A" part

(.004±.004)

(.009±.002)

(.020±.008)

(.024±.006)

MB9B360R Datasheet(PDF) 157 Page - Cypress Semiconductor

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