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MB9B360R Datasheet(PDF) 156 Page - Cypress Semiconductor |
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MB9B360R Datasheet(HTML) 156 Page - Cypress Semiconductor |
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156 / 166 page ![]() Document Number: 002-04872 Rev.*A Page 156 of 166 MB9B360R Series 14. Package Dimensions 120-pin plastic LQFP Lead pitch 0.50 mm Package width × package length 16.0 mm × 16.0 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.70 mm Max Weight 0.88 g Code (Reference) P-LFQFP120-16 × 16-0.50 120-pin plastic LQFP (FPT-120P-M37) (FPT-120P-M37) C 2010 FUJITSU SEMICONDUCTOR LIMITED F120037Sc(1)-1-1 16.00 ± 0.10(.630 ± .004) SQ 18.00 ± 0.20(.709 ± .008) SQ 1 30 31 61 91 60 90 120 0.50(.020) 0.22 ± 0.05 (.009 ± .002) M 0.08(.003) ( ) 0.08(.003) "A" INDEX .059 –.004 +.008 –0.10 +0.20 1.50 (Mounting height) 0˚~8˚ (.024 ± .006) 0.60 ± 0.15 0.25(.010) 0.10 ± 0.05 (.004 ± .002) Details of "A" part (Stand off) * LEAD No. –0.03 +0.05 0.145 –.001 +.002 .006 Dimensions in mm (inches). Note: The values in parentheses are reference values Note 1) * : These dimensions do not include resin protrusion. Note 2) Pins width and pins thickness include plating thickness. Note 3) Pins width do not include tie bar cutting remainder. |
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