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28HS01GTAM03 Datasheet(PDF) 110 Page - Infineon Technologies AG |
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28HS01GTAM03 Datasheet(HTML) 110 Page - Infineon Technologies AG |
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110 / 138 page ![]() Datasheet 110 of 138 002-18216 Rev. *W 2022-01-18 256Mb/512Mb/1Gb SEMPER™ Flash Octal interface, 1.8V/3.0V Timing characteristics tCH Clock High Time 45% pCK 55% pCK ns Figure 75 tCL Clock Low Time 45% pCK 55% pCK tCS CS# High Time (Read transactions) 10 Figure 76 / Figure 77 CS# High Time Between Transactions (aborted commands) 20 CS# High Time (Program / Erase transactions) 50 tCSS CS# Active Setup Time relative to CK (fCK 50MHz / fCK > 50MHz) 5/4 Figure 76 tCSH0 CS# Active Hold Time (relative to CK in Mode 0) 4 tCSH3 CS# Active Hold Time (relative to CK in Mode 3) 6 tSU Data Setup Time (all VCC) (fCK 50MHz / fCK > 50MHz) 5 / 2 tHD Data Hold Time (all VCC) (fCK 50MHz / fCK > 50MHz) 5 / 2 tV Clock Low to Output Valid (15pF Loading, 3.0V 3.6V, 30 Output Impedance) (HL-T) 2 6.5 ns Figure 77 Clock Low to Output Valid (30pF Loading) (HS-T) 2 8 Clock Low to Output Valid (30pF Loading) (HL-T) 2 9 Clock Low to Output Valid (15pF Loading) (HS-T) 2 6 Clock Low to Output Valid (15pF Loading) (HL-T) 2 8 tHO Output Hold Time 1.5 tDIS Output Disable Time (HS-T) 6 Output Disable Time (HL-T) 7.50 Power Up / Power Down Timing tPU VCC(min) to Read operation (HL256T / HS256T) (HL512T / HS512T) (HL01GT / HS01GT) – 550 / 600 450 / 500 500 / 500 µs Figure 63 tPD VCC(Low) time 25 – Figure 64 tVR[52] VCC / VCCQ Power Up ramp rate 1 –µs/V Figure 65 tVF VCC / VCCQ Power Down ramp rate 30.0 –µs/V Deep Power Down Mode Timing tENTDPD[52 ] Time to Enter DPD mode 3 µs tEXTDPD Time to Exit DPD mode (HL256T / HS256T) (HL512T / HS512T) (HL01GT / HS01GT) 520 / 570 380 / 430 430 / 430 Figure 62 tCSDPD Chip Select Pulse Width to Exit DPD 0.02 3 Reset Timing[46, 47] tRS Reset Setup - RESET# High before CS# Low 50 ns Figure 55 tRH Reset Pulse Hold - RESET# Low to CS# Low (HL256T / HS256T) (HL512T / HS512T) (HL01GT / HS01GT) 550 / 600 450 / 500 500 / 500 µs tRP RESET# Pulse Width 200 ns Table 85 Timing characteristics[45] (Continued) Symbol Parameter Min Typ Max Unit Reference figure Notes 43. Full VCC range and CL = 15pF. 44. Output HI-Z is defined as the point where data is no longer driven. 45. Applicable across all operating temperature options. 46. If Reset# is asserted during the end of tPU, the device will remain in the reset state and tRH will determine when CS# may go Low. 47. Sum of tRP and tRH must be equal to or greater than tRPH. 48. Typical program and erase times assume the following conditions: 25°C, VCC = 1.8V and 3.0V; checkerboard data pattern. 49. The programming time for any OTP programming transaction is the same as tPP. This includes PRSSR_4_1. 50. The programming time for the PRPPB_4_0 transaction is the same as tPP. The erase time for ERPPB_0_0 transaction is the same as tSE. 51. Values are guaranteed by characterization and not 100% tested in production. 52. Guaranteed by design. 53. The Joint Electron Device Engineering Council (JEDEC) standard JESD22-A117 defines the procedural requirements for performing valid endurance and retention tests based on a qualification specification. This methodology is intended to determine the ability of a flash device to sustain repeated data changes without failure (program/erase endurance) and to retain data for the expected life (data retention). Endurance and retention qualifica- tion specifications are specified in JESD47 or may be developed using knowledge-based methods as in JESD94. |
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