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511820003 Datasheet(PDF) 17 Page - OSRAM GmbH |
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511820003 Datasheet(HTML) 17 Page - OSRAM GmbH |
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17 / 52 page ![]() Document Feedback Mira130 Absolute Maximum Ratings Datasheet • PUBLIC DS000715 • v6-00 • 2023-Aug-09 51 │ 16 5 Absolute Maximum Ratings Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated under “Operating Conditions” is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Figure 12: Absolute Maximum Ratings of Mira130 Symbol Parameter Min Max Unit Comments Electrical Parameters VAVDD Analog Supply Voltage -0.3 3.0 V VDOVDD I/O Supply Voltage -0.3 2.2 V VDVDD Digital Supply Voltage -0.3 1.4 V I/O Input Voltage -0.3 VDOVDD + 0.3 V I/O Output Voltage -0.3 VDOVDD + 0.3 V ISCR Input Current (latch-up immunity) ± 200 mA JEDEC JESD78E Nov 2016 Electrostatic Discharge ESDHBM Electrostatic Discharge HBM ± 3.5 kV MIL-STD-883J Method 3015.9 ESDCDM Electrostatic Discharge CDM ± 250 V C1=200pF ANSI/ESDA/JEDEC JS- 002-2014 Temperature Ranges and Storage Conditions TA Operating Ambient Temperature -30 80 °C TSPEC Operating Temperature Spec -20 60 °C Best performance(1) TJ Operating Junction Temperature -25 85 °C TSTRG_WAF Storage Temperature Range Wafer 20 30 °C tSTRG_WAF Storage Time Wafer 6 months RHNC_WAF Relative Humidity (non- condensing) Wafer 30 % N2 Wafer Stocker condition(2) MSLDIE Moisture Sensitivity Level bare die N/A (1) Ideal temperature range for best performance (2) Die and wafers, when in storage, should be stored at temperature between 20 °C and 30 °C, relative humidity of less than 30%, and in clean, dry, inert atmosphere (e.g. Nitrogen) or in a vacuum sealed bag. |
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