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AN2208 Datasheet(PDF) 11 Page - STMicroelectronics |
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AN2208 Datasheet(HTML) 11 Page - STMicroelectronics |
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11 / 51 page ![]() AN2208 2 VN808 reference design board 11/51 2.4 Heatsink recommendations Depending on ambient thermal conditions, HSD’s with a PowerSO10/SO36 package require external cooling as the copper bottom plate of the PSO-Package, used to maintain the junction temperature during inductive switching, acts as a thermal capacitor. Figure 6. Typical input/status isolation by optocouplers Figure 7. Burst pulse affecting one input |
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