PIC16C765SLASHP datasheet(125/158 Pages) MICROCHIP

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DS41124A-page 125

PIC16C745/765

16.1

DC Characteristics:

PIC16C745/765 (Commercial, Industrial)

DC CHARACTERISTICS

Standard Operating Conditions (unless otherwise stated)

Operating temperature

0°C

≤ TA ≤

+70°C

for commercial

-40°C

≤ TA ≤

+85°C

for industrial

Param

No.

Sym

Characteristic

Min

Typ†

Max

Units

Conditions

D001

VDD

Supply Voltage

4.35

–

5.25

See Figure 16-1

D002*

VDR

RAM Data Retention

Voltage (Note 1)

–

1.5

–

D003

VPOR

VDD Start Voltage to ensure

internal

Power-on Reset signal

–

VSS

–

See section on Power-on Reset for details

D004*

D004A*

SVDD

VDD Rise Rate to ensure inter-

nal Power-on Reset signal

0.05

TBD

–

V/mS

PWRT enabled (PWRTE bit clear)

PWRT disabled (PWRTE bit set)

See section on Power-on Reset for details

D005

VBOR

Brown-out Reset

voltage trip point

3.65

–

4.35

Brown-out Reset is always active

D010

D013

IDD

Supply Current

(Note 2, 4)

TBD

FINT = 24 MHz, VDD = 4.35V

FINT = 24 MHz, VDD = 5.25V

D020

D021

D021B

IPD

Power-down Current

(Note 3, 4)

TBD

µA

VDD = 4.35V

VDD = 5.25V

D022*

D022A*

∆IWDT

∆IBOR

∆ICCP

∆IA/D

∆IUSB

∆PLL

Module Differential

Current (Note 5, 6)

Watchdog Timer

Brown-out Reset

Capture Compare PWM

Analog

Not suspend mode

Suspend mode

Phase Lock Loop

–

TBD

6.0

100

TBD

150

TBD

µA

WDTE bit set, VDD = 4.35V

BODEN bit set, VDD = 5.0V

FOSC

HS oscillator operating freq.

H4 oscillator operating freg.

EC oscillator operating freq.

E4 oscillator operating freq.

—

MHz

All temperatures

* These parameters are characterized but not tested.

† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested.

Note 1:

This is the limit to which VDD can be lowered without losing RAM data.

The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and

switching rate, oscillator type, internal code execution pattern and temperature also have an impact on the current consump-

tion.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD,

MCLR = VDD; WDT enabled/disabled as specified.

The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with the

part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.

Timer1 oscillator (when enabled) adds approximately 20

µA to the specification. This value is from characterization and is for

design guidance only. This is not tested.

The

∆ current is the additional current consumed when this peripheral is enabled. This current should be added to the base IDD

or IPD measurement.

Module differential currents measured at FINT = 24 MHz.

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