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PIC16C765/P Datasheet(PDF) 147 Page - Microchip Technology |
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PIC16C765/P Datasheet(HTML) 147 Page - Microchip Technology |
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147 / 158 page ![]() © 1999 Microchip Technology Inc. Advanced Information DS41124A-page 147 PIC16C745/765 28-Lead Ceramic Dual In-line with Window (JW) – 600 mil (CERDIP) 7.37 7.11 6.86 .290 .280 .270 W Window Diameter 18.03 16.76 15.49 .710 .660 .610 eB Overall Row Spacing 0.58 0.51 0.41 .023 .020 .016 B Lower Lead Width 1.65 1.46 1.27 .065 .058 .050 B1 Upper Lead Width 0.30 0.25 0.20 .012 .010 .008 c Lead Thickness 3.81 3.49 3.18 .150 .138 .125 L Tip to Seating Plane 37.85 37.08 36.32 1.490 1.460 1.430 D Overall Length 13.36 13.21 13.06 .526 .520 .514 E1 Ceramic Pkg. Width 15.88 15.24 15.11 .625 .600 .595 E Shoulder to Shoulder Width 1.52 0.95 0.38 .060 .038 .015 A1 Standoff 4.19 4.06 3.94 .165 .160 .155 A2 Ceramic Package Height 5.08 4.70 4.32 .200 .185 .170 A Top to Seating Plane 2.54 .100 p Pitch 28 28 n Number of Pins MAX NOM MIN MAX NOM MIN Dimension Limits MILLIMETERS INCHES* Units 2 1 D n E1 W c E eB p A2 L B1 B A1 A *Controlling Parameter JEDEC Equivalent: MO-103 Drawing No. C04-013 |
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