ICL3221EM, ICL3221EF

2. Specifications

FN7552 Rev.2.00

Page 5 of 22

May.29.19

2.

Specifications

2.1

Absolute Maximum Ratings

2.2

Thermal Information

2.3

Recommended Operating Conditions

2.4

Electrical Specifications

Parameter

Minimum

Maximum

Unit

VCC to Ground

-0.3

6

V

V+ to Ground

-0.3

7

V

V- to Ground

+0.3

-7

V

V+ to V-

14

V

Input Voltages

TIN, FORCEOFF, FORCEON, EN

-0.3

6

V

RIN

±25

V

Output Voltages

TOUT

±13.2

V

ROUT, INVALID

-0.3

VCC +0.3

V

Short-Circuit Duration

TOUT

Continuous

ESD Rating

(See “ESD Performance” on page 7)

CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions can adversely

impact product reliability and result in failures not covered by warranty.

Thermal Resistance (Typical, Note 4)θJA (°C/W)

16 Ld TSSOP Package

145

Note:

4. θJA is measured with the component mounted on a low-effective thermal conductivity test board in free air. See TB379.

Parameter

Minimum

Maximum

Unit

Maximum Junction Temperature (Plastic Package)

+150

°C

Maximum Storage Temperature Range

-65

+150

°C

Pb-Free Reflow Profile

see TB493

Parameter

Minimum

Maximum

Unit

Operating Voltage

+3.0

+3.6

V

Temperature Range

ICL3221EM

-55

+125

°C

ICL3221EF

-40

+125

°C

Test conditions: VCC = 3.3V ±10%, C1 - C4 = 0.1µF; unless otherwise specified. Typicals at TA = +25°C. Boldface limits apply across the

operating temperature ranges, -55°C to +125°C (ICL3221EM) and -40°C to +125°C (ICL3221EF).

Parameter

Test Conditions

Temp

(°C)

Min

(Note 6)Typ

Max

(Note 6)Unit

DC Characteristics

Supply Current, Automatic

Power-Down

All RIN Open, FORCEON = GND, FORCEOFF = VCC

Full

1.0

10

µA