FN7552 datasheet(21/22 Pages) RENESAS

21 / 22 page

ICL3221EM, ICL3221EF

8. Package Outline Drawing

FN7552 Rev.2.00

Page 21 of 22

May.29.19

Package Outline Drawing

M16.173

16 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)

Rev 2, 5/10

0.09-0.20

SEE DETAIL "X"

DETAIL "X"

TYPICAL RECOMMENDED LAND PATTERN

TOP VIEW

SIDE VIEW

END VIEW

Dimension does not include mold flash, protrusions or gate burrs.

Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.

Dimension does not include interlead flash or protrusion. Interlead

flash or protrusion shall not exceed 0.25 per side.

Dimensions are measured at datum plane H.

Dimensioning and tolerancing per ASME Y14.5M-1994.

Dimension does not include dambar protrusion. Allowable protrusion

shall be 0.08mm total in excess of dimension at maximum material

condition. Minimum space between protrusion and adjacent lead

is 0.07mm.

Dimension in ( ) are for reference only.

Conforms to JEDEC MO-153.

NOTES:

(0.65 TYP)

(5.65)

(0.35 TYP)

0.90 +0.15/-0.10

0.60 ±0.15

0.15 MAX

0.05 MIN

PLANE

GAUGE

0°-8°

0.25

1.00 REF

(1.45)

PIN #1

I.D. MARK

5.00 ±0.10

6.40

4.40 ±0.10

0.65

1.20 MAX

SEATING

PLANE

0.25 +0.05/-0.06 5

0.20 C B A

0.10 C

- 0.05

0.10

C B A

For the most recent package outline drawing, see M16.173.

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