DAC7678SPW datasheet(2/52 Pages) TI

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DAC7678

SBAS493A – FEBRUARY 2010 – REVISED AUGUST 2010

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PACKAGE/ORDERING INFORMATION(1)

MAXIMUM

SPECIFIED

PACKAGE-

PACKAGE

PRODUCT

RELATIVE

DIFFERENTIAL

REFERENCE DRIFT

TEMPERATURE

LEAD

DESIGNATOR

MARKING

ACCURACY (LSB)

NONLINEARITY (LSB)

(ppm/°C)

RANGE

TSSOP-16

DAC7678

±1

±0.25

–40°C to +125°C

DAC7678

QFN-24

RGE

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range, unless otherwise noted.

DAC7678

UNIT

AVDD to GND

–0.3 to +6

Digital input voltage to GND

–0.3 to +AVDD + 0.3

VOUT to GND

–0.3 to +AVDD + 0.3

VREFIN/VREFOUT to GND

–0.3 to +AVDD + 0.3

Operating temperature range

–40 to +125

°C

Storage temperature range

–65 to +150

°C

Junction temperature range (TJ max)

+150

°C

Power dissipation

(TJ max – TA)/qJA

(1)

Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute

maximum conditions for extended periods may affect device reliability.

THERMAL INFORMATION

DAC7678

THERMAL METRIC(1)

UNITS

PW (16 PINS)

RGE (24 PINS)

qJA

Junction-to-ambient thermal resistance

111.9

33.7

qJCtop

Junction-to-case (top) thermal resistance

33.3

16.9

qJB

Junction-to-board thermal resistance

52.4

7.4

°C/W

yJT

Junction-to-top characterization parameter

0.5

yJB

Junction-to-board characterization parameter

51.2

7.1

qJCbot

Junction-to-case (bottom) thermal resistance

n/a

1.7

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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