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GRM552B11H102KA01D Datasheet(PDF) 100 Page - Murata Manufacturing Co., Ltd.

Part # GRM552B11H102KA01D
Description  Chip Monolithic Ceramic Capacitors
PDF  221 Pages
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Manufacturer  MURATA [Murata Manufacturing Co., Ltd.]
Direct Link  http://www.murata.com
Logo MURATA - Murata Manufacturing Co., Ltd.

GRM552B11H102KA01D Datasheet(HTML) 100 Page - Murata Manufacturing Co., Ltd.

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!Note 1. This Specifications and Test Methods is downloaded from the website of Murata Manufacturing co.,ltd. Therefore, it's specifications are subject to change or our products in it may be discontinued without advance notice.
0. Please check with our sales representatives or product engineers before ordering.
2. This Specifications and Test Methods has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product
0. specifications before ordering.
GJM Series Specifications and Test Methods (1)
Continued from the preceding page.
Continued on the following page.
(in mm)
Fig. 2
Type
a
b
c
GJM03
GJM15
0.3
0.4
0.9
1.5
0.3
0.5
75% of the terminations are to be soldered evenly and
continuously.
Solderability of
Termination
13
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion).
Preheat at 80 to 120
D for 10 to 30 seconds. After preheating,
immerse in eutectic solder solution for 2
T0.5 seconds at 230T5D
or Sn-3.0Ag-0.5Cu solder solution for 2±0.5 seconds at 245±5°C.
More than 10,000M
Ω or 500Ω · F (whichever is smaller)
Within
T2.5% or T0.25pF
(whichever is larger)
30pF and over: Q
U1000
30pF and below: Q
U400W20C
C: Nominal Capacitance (pF)
Appearance
I.R.
Capacitance
Change
Q
No marking defects
The measured and observed characteristics should satisfy the
specifications in the following table.
Resistance
to Soldering
Heat
14
Preheat the capacitor at 120 to 150
D for 1 minute.
Immerse the capacitor in a eutectic solder or Sn-3.0Ag-0.5Cu
solder solution at 270
T5D for 10T0.5 seconds.
Let sit at room temperature for 24
T2 hours.
No failure
Dielectric
Strength
More than 10,000M
Ω or 500Ω · F (whichever is smaller)
Within
T2.5% or T0.25pF
(whichever is larger)
30pF and over: Q
U1000
30pF and below: Q
U400W20C
C: Nominal Capacitance (pF)
Appearance
I.R.
Capacitance
Change
Q
No marking defects
The measured and observed characteristics should satisfy the
specifications in the following table.
Temperature
Cycle
15
Fix the capacitor to the supporting jig in the same manner and
under the same conditions as (10). Perform the five cycles
according to the four heat treatments listed in the following table.
Let sit for 24
T2 hours at room temperature, then measure.
No failure
Dielectric
Strength
More than 10,000M
Ω or 500Ω · F (whichever is smaller)
Within
T5% or T0.5pF
(whichever is larger)
30pF and below:
Q
U350
10pF and over, 30pF and below: Q
U275W
C
10pF and below:
Q
U200W10C
C: Nominal Capacitance (pF)
5
2
Appearance
I.R.
Capacitance
Change
Q
No marking defects
The measured and observed characteristics should satisfy the
specifications in the following table.
Humidity,
Steady
State
16
Let the capacitor sit at 40
T2D and 90 to 95% humidity for
500
T12 hours.
Remove and let sit for 24
T2 hours (temperature compensating
type) at room temperature, then measure.
30pF and over: Q
U1000
30pF and below: Q
U400W20C
C: Nominal Capacitance (pF)
No defects or abnormalities
Within the specified tolerance
Vibration
Resistance
11
Solder the capacitor to the test jig (glass epoxy board) in the
same manner and under the same conditions as (10).
The capacitor should be subjected to a simple harmonic motion
having a total amplitude of 1.5mm, the frequency being varied
uniformly between the approximate limits of 10 and 55Hz.
The frequency range, from 10 to 55Hz and return to 10Hz,
should be traversed in approximately 1 minute. This motion
should be applied for a period of 2 hours in each of 3 mutually
perpendicular directions (total of 6 hours).
Appearance
Capacitance
Q
Deflection
12
Solder the capacitor to the test jig (glass epoxy boards) shown
in Fig. 2 using a eutectic solder.
Then apply a force in the direction shown in Fig. 3.
The soldering should be done by the reflow method and should
be conducted with care so that the soldering is uniform and free
of defects such as heat shock.
b
a
c
100
φ4.5
Capacitance meter
Flexure :
V1
20
50
R230
Pressurizing
speed: 1.0mm/sec.
Pressurize
45
45
Fig. 3
t: 0.8mm
Step
1234
Temp. (
D)
Time (min.)
Min. Operating
Temp.
W0/Y3
Room
Temp.
Max. Operating
Temp.
W3/Y0
Room
Temp.
30
T3
2 to 3
30
T3
2 to 3
No.
Item
Specifications
Test Method
Temperature Compensating Type
(in mm)
Within
T5% or T0.5pF
(whichever is larger)
Capacitance
Change
No marking defects
Appearance
GJM Series Specifications and Test Methods
98
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
C02E.pdf
10.12.20



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