GRM552B11H102KA01D datasheet(179/221 Pages) MURATA

179 / 221 page

Only for LCD Backlight Inverter Circuit Specifications and Test Methods

Continued from the preceding page.

* "Room condition" Temperature: 15 to 35

D, Relative humidity: 45 to 75%, Atmospheric pressure: 86 to 106kPa

Apply 120% of the rated voltage for 1,000

W48

Y 0

hrs. at maximum

operating temperature

T3D.

Remove and let sit for 24

T2 hrs. at room condition,* then

measure.

The charge/discharge current is less than 50mA.

Life

Appearance

No marking defects

Capacitance

Change

Within

T3.0%

350 min.

I.R.

More than 1,000M

Ω

Dielectric

Strength

In accordance with item No.4

Let the capacitor sit at 40

T2D and relative humidity of 90 to 95%

for 500

W24

Y 0

hrs.

Remove and let sit for 24

T2 hrs. at room condition,* then

measure.

Humidity

(Steady

State)

Appearance

No marking defects

Capacitance

Change

Within

T5.0%

350 min.

I.R.

More than 1,000M

Ω

Dielectric

Strength

In accordance with item No.4

Fix the capacitor to the supporting jig (glass epoxy board) shown

in Fig. 4.

Perform the 5 cycles according to the 4 heat treatments listed in

the following table.

Let sit for 24

T2 hrs. at room condition,* then measure.

Fig. 4

Temperature

Cycle

Appearance

No marking defects

Capacitance

Change

Within

T2.5%

1,000 min.

I.R.

More than 10,000M

Ω

Dielectric

Strength

In accordance with item No.4

Preheat the capacitor as in table.

Immerse the capacitor in solder solution at 260

T5D for 10T1 sec.

Let sit at room condition* for 24

T2 hrs., then measure.

#Immersing speed: 25T2.5mm/s

*Preheating

Resistance

to Soldering

Heat

Appearance

No marking defects

Capacitance

Change

Within

T2.5%

1,000 min.

I.R.

More than 10,000M

Ω

Dielectric

Strength

In accordance with item No.4

Immerse the capacitor in a solution of ethanol (JIS-K-8101) and

rosin (JIS-K-5902) (25% rosin in weight proportion). Immerse in

solder solution for 2

T0.5 sec.

Immersing speed: 25

T2.5mm/s

Temp. of solder: 245

T5°C Lead Free Solder (Sn-3.0Ag-0.5Cu)

235

T5°C H60A or H63A Eutectic Solder

Solderability of

Termination

75% of the terminations are to be soldered evenly

and continuously.

No.

Test Method

Specifications

Item

Step

Temperature

100 to 120

170 to 200

Time

1 min.

Step

Temperature (

Min. Operating Temp.

Room Temp.

Max. Operating Temp.

Room Temp.

Time (min.)

2 to 3

Solder resist

Glass Epoxy Board

GRM/DC3.15kV Series Specifications and Test Methods

178

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our

sales representatives or product engineers before ordering.

• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

C02E.pdf

10.12.20

GRM552B11H102KA01D Datasheet(PDF) 179 Page - Murata Manufacturing Co., Ltd.

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