GRM552B11H102KA01D datasheet(212/221 Pages) MURATA

212 / 221 page

,,,

4. Reflow Soldering

When components are exposed to sudden heat, their

mechanical strength can be decreased due to the

extreme temperature changes which can cause flexing

and result in internal mechanical damage, which will

cause the parts to fail. In order to prevent mechanical

damage, preheating is required for both the components

and the PCB board. Preheating conditions are shown in

Table 1. It is required to keep the temperature differential

between the soldering and the components surface (

∆T)

as small as possible.

Solderability of Tin plating termination chips might be

deteriorated when low temperature soldering profile

where peak solder temperature is below the Tin melting

point is used. Please confirm the solderability of Tin

plating termination chips before use.

When components are immersed in solvent after

mounting, be sure to maintain the temperature difference

(

∆T) between the component and solvent within the

range shown in the Table 1.

--18/21/31

--32/42/43/52/55

∆TV190D

∆TV130D

Part Number

Temperature Differential

Table 1

Recommended Conditions

[Standard Conditions for Reflow Soldering]

[Allowable Soldering Temperature and Time]

In the case of repeated soldering, the accumulated

soldering time must be within the range shown above.

,,,

Soldering Time (sec.)

260

270

250

240

230

030

Inverting the PCB

Make sure not to impose an abnormal mechanical shock on

the PCB.

Continued from the preceding page.

Peak Temperature

Atmosphere

Pb-Sn Solder

Infrared Reflow

230-250

°C

Air

Vapor Reflow

230-240

°C

Air

Lead Free Solder

240-260

°C

Air or N2

Infrared Reflow

Vapor Reflow

60-120 seconds 30-60 seconds

,,,

∆T

Gradual

Cooling

Soldering

Preheating

200

°C

170

°C

150

°C

130

°C

Time

Temperature (

Peak Temperature

60-120 seconds

20 seconds max.

∆T

Gradual

Cooling

Soldering

Preheating

170

°C

150

°C

130

°C

Time

Temperature (

Peak Temperature

Pb-Sn Solder: Sn-37Pb

Lead Free Solder: Sn-3.0Ag-0.5Cu

Continued on the following page.

Optimum Solder Amount for Reflow Soldering

Overly thick application of solder paste results in

excessive solder fillet height.

This makes the chip more susceptible to mechanical and

thermal stress on the board and may cause cracked

chips.

Too little solder paste results in a lack of adhesive

strength on the outer electrode, which may result in chips

breaking loose from the PCB.

Make sure the solder has been applied smoothly to the

end surface to a height of 0.2mm min.

[Optimum Solder Amount for Reflow Soldering]

0.2mm min.

in section

!Caution

211

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our

sales representatives or product engineers before ordering.

• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

C02E.pdf

10.12.20

GRM552B11H102KA01D Datasheet(PDF) 212 Page - Murata Manufacturing Co., Ltd.

GRM552B11H102KA01D Datasheet(HTML) 212 Page - Murata Manufacturing Co., Ltd.

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

Datasheet Download

Link URL