BQ7693003DBT datasheet(53/63 Pages) TI1

53 / 63 page

bq76920, bq76930, bq76940

www.ti.com

SLUSBK2F – OCTOBER 2013 – REVISED NOVEMBER 2015

11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation

For related documentation, see the following: bq76920 Evaluation Module User 's Guide (SLVU924), and

bq76920, bq76930, bq76940 AFE FAQ (SLUUB41).

11.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community

resources, tools and software, and quick access to sample or buy.

Table 11-1. Related Links

TECHNICAL

TOOLS &

SUPPORT &

PARTS

PRODUCT FOLDER

SAMPLE & BUY

DOCUMENTS

SOFTWARE

COMMUNITY

bq76920

Click here

bq76930

Click here

bq76940

Click here

11.2.1 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the

respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;

see TI's Terms of Use.

TI E2E™ Online Community

TI's

Engineer-to-Engineer

(E2E)

Community.

Created

foster

collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge,

explore ideas and help solve problems with fellow engineers.

TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help

developers get started with Embedded Processors from Texas Instruments and to foster

innovation and growth of general knowledge about the hardware and software surrounding

these devices.

11.3 Trademarks

E2E is a trademark of Texas Instruments.

I2C is a trademark of NXP B.V. Corporation.

All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.5 Glossary

TI Glossary This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the

most current data available for the designated devices. This data is subject to change without notice and

revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Mechanical, Packaging, and Orderable Information

Submit Documentation Feedback

Product Folder Links: bq76920 bq76930 bq76940

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