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DAC8750IPWPR Datasheet(PDF) 2 Page - Texas Instruments

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Part # DAC8750IPWPR
Description  DACx750 Single-Channel, 12- and 16-Bit Programmable Current Output Digital-to-Analog Converters for 4-mA to 20-mA Current Loop Applications
PDF  53 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

DAC8750IPWPR Datasheet(HTML) 2 Page - Texas Instruments

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DAC7750, DAC8750
SBAS538B – DECEMBER 2013 – REVISED JUNE 2016
www.ti.com
Product Folder Links: DAC7750 DAC8750
Submit Documentation Feedback
Copyright © 2013–2016, Texas Instruments Incorporated
Table of Contents
1
Features .................................................................. 1
2
Applications ........................................................... 1
3
Description ............................................................. 1
4
Revision History..................................................... 2
5
Device Comparison Table..................................... 3
6
Pin Configuration and Functions ......................... 3
7
Specifications......................................................... 5
7.1
Absolute Maximum Ratings ...................................... 5
7.2
ESD Ratings.............................................................. 5
7.3
Recommended Operating Conditions ....................... 5
7.4
Thermal Information .................................................. 6
7.5
Electrical Characteristics........................................... 6
7.6
Electrical Characteristics: AC.................................... 9
7.7
Timing Requirements: Write Mode ........................... 9
7.8
Timing Requirements: Readback Mode.................... 9
7.9
Timing Requirements: Daisy-Chain Mode .............. 10
7.10
Typical Characteristics .......................................... 12
8
Detailed Description ............................................ 20
8.1
Overview ................................................................. 20
8.2
Functional Block Diagram ....................................... 20
8.3
Feature Description................................................. 21
8.4
Device Functional Modes........................................ 27
8.5
Programming........................................................... 29
8.6
Register Maps ......................................................... 31
9
Application and Implementation ........................ 34
9.1
Application Information............................................ 34
9.2
Typical Application .................................................. 36
10
Power-Supply Recommendations ..................... 38
11
Layout................................................................... 39
11.1
Layout Guidelines ................................................. 39
11.2
Layout Example .................................................... 39
11.3
Thermal Considerations ........................................ 40
12
Device and Documentation Support ................. 41
12.1
Documentation Support ........................................ 41
12.2
Related Links ........................................................ 41
12.3
Receiving Notification of Documentation Updates 41
12.4
Community Resources.......................................... 41
12.5
Trademarks ........................................................... 41
12.6
Electrostatic Discharge Caution ............................ 41
12.7
Glossary ................................................................ 41
13
Mechanical, Packaging, and Orderable
Information ........................................................... 42
4 Revision History
Changes from Revision A (March 2012) to Revision B
Page
•
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section .................................................................................................. 1
•
Added I/O column to Pin Functions table ............................................................................................................................... 4
•
Moved Thermal Considerations from Power Supply Recommendations to Layout ............................................................ 40
Changes from Original (December 2013) to Revision A
Page
•
Changed format to meet latest data sheet standards; added new sections and moved existing sections ........................... 1
•
Changed data sheet from 1-page product preview to full production data ............................................................................ 1
•
Updated Layout Schematic .................................................................................................................................................. 39



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