AD9542BCPZ datasheet(18/61 Pages) AD

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AD9542

Data Sheet

Rev. 0 | Page 18 of 61

ABSOLUTE MAXIMUM RATINGS

Table 23.

Parameter

Rating

1.8 V Supply Voltage (VDD)

2 V

Input/Output Supply Voltage

(VDDIOA, VDDIOB)

3.6 V

Input Voltage Range (XOA, XOB,

REFA, REFAA, REFB, REFBB Pins)

−0.5 V to VDD + 0.5 V

Digital Input Voltage Range

SDO/M5, SCLK/SCL, SDIO/SDA,

CSB/M6 Pins

−0.5 V to VDDIOA + 0.5 V

M0, M1, M2, M3, M4 Pins

−0.5 V to VDDIOB + 0.5 V

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range1

−40°C to +85°C

Lead Temperature (Soldering 10 sec)

300°C

1 See the Thermal Resistance section for additional information.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

Table 24. Thermal Resistance

Symbol

Thermal Characteristic Using a

JEDEC51-7 Plus JEDEC51-5 2S2P

Test Board1

Value

Unit

θJA

Junction to ambient thermal

resistance, 0.0 m/sec airflow per

JEDEC JESD51-2 (still air)

23.92

°C/W

θJMA

Junction to ambient thermal

resistance, 1.0 m/sec airflow per

JEDEC JESD51-6 (moving air)

19.42

°C/W

θJMA

Junction to ambient thermal

resistance, 2.5 m/sec airflow per

JEDEC JESD51-6 (moving air)

18.22

°C/W

θJC

Junction to case thermal resistance

(die to heat sink) per MIL-STD 883,

Method 1012.1

1.52

°C/W

1 The exposed pad on the bottom of the package must be soldered to ground

to achieve the specified thermal performance.

Values of θJA are for package comparison and PCB design

considerations. θJA provides for a first-order approximation of TJ

per the following equation:

= TA + (θJA × PD)

where TA is the ambient temperature (°C).

Values of θJC are for package comparison and PCB design

considerations when an external heat sink is required.

ESD CAUTION

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