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TMS320F28375DPZP Datasheet(PDF) 52 Page - Texas Instruments |
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TMS320F28375DPZP Datasheet(HTML) 52 Page - Texas Instruments |
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52 / 222 page  52 TMS320F28379D, TMS320F28378D, TMS320F28377D TMS320F28376D, TMS320F28375D, TMS320F28374D SPRS880K – DECEMBER 2013 – REVISED NOVEMBER 2018 www.ti.com Submit Documentation Feedback Product Folder Links: TMS320F28379D TMS320F28378D TMS320F28377D TMS320F28376D TMS320F28375D TMS320F28374D Specifications Copyright © 2013–2018, Texas Instruments Incorporated 5.5 Power Consumption Summary Current values listed in this section are representative for the test conditions given and not the absolute maximum possible. The actual device currents in an application will vary with application code and pin configurations. Table 5-1 shows the device current consumption at 200-MHz SYSCLK. (1) IDDIO current is dependent on the electrical loading on the I/O pins. (2) TYP: Vnom, 30°C (3) MAX: Vmax, 125°C (4) The following is executed in a loop on CPU1: • All of the communication peripherals are exercised in loop-back mode: CAN-A to CAN-B; SPI-A to SPI-C; SCI-A to SCI-D; I2C-A to I2C-B; McBSP-A to McBSP-B; USB • SDFM1 to SDFM4 active • ePWM1 to ePWM12 generate 400-kHz PWM output on 24 pins • CPU TIMERs active • DMA does 32-bit burst transfers • CLA1 does multiply-accumulate tasks • All ADCs perform continuous conversion • All DACs ramp voltage up/down at 150 kHz • CMPSS1 to CMPSS8 active The following is executed in a loop on CPU2: • CPU TIMERs active • CLA1 does multiply-accumulate tasks • VCU does complex multiply/accumulate with parallel load • TMU calculates a cosine • FPU does multiply/accumulate with parallel load (5) CPU2 must go into IDLE mode before CPU1 enters HALT mode. (6) CPU2 must go into reset/IDLE/STANDBY mode before CPU1 enters HIBERNATE mode. (7) Brownout events during flash programming can corrupt flash data. Programming environments using alternate power sources (such as a USB programmer) must be capable of supplying the rated current for the device and other system components with sufficient margin to avoid supply brownout conditions. Table 5-1. Device Current Consumption at 200-MHz SYSCLK MODE TEST CONDITIONS IDD IDDIO (1) IDDA IDD3VFL TYP(2) MAX(3) TYP(2) MAX(3) TYP(2) MAX(3) TYP(2) MAX(3) Operational • Code is running out of RAM.(4) • All I/O pins are left unconnected. • Peripherals not active have their clocks disabled. • FLASH is read and in active state. • XCLKOUT is enabled at SYSCLK/4. 325 mA 495 mA 30 mA 13 mA 20 mA 33 mA 40 mA IDLE • Both CPU1 and CPU2 are in IDLE mode. • Flash is powered down. • XCLKOUT is turned off. 105 mA 250 mA 3 mA 10 mA 10 µA 150 µA 10 µA 150 µA STANDBY • Both CPU1 and CPU2 are in STANDBY mode. • Flash is powered down. • XCLKOUT is turned off. 30 mA 170 mA 3 mA 10 mA 5 µA 150 µA 10 µA 150 µA HALT(5) • CPU1 watchdog is running. • Flash is powered down. • XCLKOUT is turned off. 1.5 mA 120 mA 750 µA 2 mA 5 µA 150 µA 10 µA 150 µA HIBERNATE(6) • CPU1.M0 and CPU1.M1 RAMs are in low-power data retention mode. • CPU2.M0 and CPU2.M1 RAMs are in low-power data retention mode. 300 µA 5 mA 750 µA 2 mA 5 µA 75 µA 1 µA 50 µA Flash Erase/Program(7) • CPU1 is running from RAM. • CPU2 is running from Flash. • All I/O pins are left unconnected. • Peripheral clocks are disabled. • CPU1 is performing Flash Erase and Programming. • CPU2 is accessing Flash locations to keep bank active. • XCLKOUT is turned off. 242 mA 360 mA 3 mA 10 mA 10 µA 150 µA 53 mA 65 mA |
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