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TMS320F28375DPZP Datasheet(PDF) 57 Page - Texas Instruments |
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TMS320F28375DPZP Datasheet(HTML) 57 Page - Texas Instruments |
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57 / 222 page  57 TMS320F28379D, TMS320F28378D, TMS320F28377D TMS320F28376D, TMS320F28375D, TMS320F28374D www.ti.com SPRS880K – DECEMBER 2013 – REVISED NOVEMBER 2018 Submit Documentation Feedback Product Folder Links: TMS320F28379D TMS320F28378D TMS320F28377D TMS320F28376D TMS320F28375D TMS320F28374D Specifications Copyright © 2013–2018, Texas Instruments Incorporated (1) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards: • JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air) • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements (2) lfm = linear feet per minute 5.7 Thermal Resistance Characteristics 5.7.1 ZWT Package °C/W(1) AIR FLOW (lfm)(2) RΘJC Junction-to-case thermal resistance 8.3 N/A RΘJB Junction-to-board thermal resistance 11.6 N/A RΘJA (High k PCB) Junction-to-free air thermal resistance 21.5 0 RΘJMA Junction-to-moving air thermal resistance 19.0 150 17.8 250 16.5 500 PsiJT Junction-to-package top 0.2 0 0.3 150 0.4 250 0.5 500 PsiJB Junction-to-board 11.4 0 11.3 150 11.2 250 11.0 500 (1) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards: • JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air) • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements (2) lfm = linear feet per minute 5.7.2 PTP Package °C/W(1) AIR FLOW (lfm)(2) RΘJC Junction-to-case thermal resistance 6.97 N/A RΘJB Junction-to-board thermal resistance 6.05 N/A RΘJA (High k PCB) Junction-to-free air thermal resistance 17.8 0 RΘJMA Junction-to-moving air thermal resistance 12.8 150 11.4 250 10.1 500 PsiJT Junction-to-package top 0.11 0 0.24 150 0.33 250 0.42 500 PsiJB Junction-to-board 6.1 0 5.5 150 5.4 250 5.3 500 |
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