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DSPIC33EP128GS708 Datasheet(PDF) 449 Page - Microchip Technology

Part # DSPIC33EP128GS708
Description  16-Bit Digital Signal Controllers for Digital Power Applications with Interconnected High-Speed PWM, ADC, PGA and Comparators
PDF  484 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

DSPIC33EP128GS708 Datasheet(HTML) 449 Page - Microchip Technology

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 2016-2018 Microchip Technology Inc.
DS70005258C-page 449
dsPIC33EPXXXGS70X/80X FAMILY
Microchip Technology Drawing C04-385 Rev C Sheet 2 of 2
Number of Terminals
Overall Height
Terminal Width
Overall Width
Overall Length
Terminal Length
Exposed Pad Width
Exposed Pad Length
Terminal Thickness
Pitch
Standoff
Units
Dimension Limits
A1
A
b
D
E2
D2
A3
e
L
E
N
0.65 BSC
0.127 REF
4.55
4.55
0.30
0.25
0.45
0.00
0.30
6.00 BSC
0.40
4.65
4.65
0.50
0.02
6.00 BSC
MILLIMETERS
MIN
NOM
28
4.75
4.75
0.50
0.35
0.55
0.05
MAX
K-
0.20
-
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1.
2.
3.
Notes:
Pin 1 visual index feature may vary, but must be located within the hatched area.
Package is saw singulated
Dimensioning and tolerancing per ASME Y14.5M
Terminal-to-Exposed-Pad
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Exposed Pad Corner Chamfer
P
-
0.35
-
28-Lead Ultra Thin Plastic Quad Flat, No Lead Package (2N) - 6x6x0.55 mm Body [UQFN]
With 4.65x4.65 mm Exposed Pad and Corner Anchors
0.35
0.40
0.43
Corner Anchor Pad
b1
0.15
0.20
0.25
Corner Pad, Metal Free Zone
b2



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