Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

Preview PDF HTML

DSPIC33EP128GS708 Datasheet(PDF) 450 Page - Microchip Technology

Part # DSPIC33EP128GS708
Description  16-Bit Digital Signal Controllers for Digital Power Applications with Interconnected High-Speed PWM, ADC, PGA and Comparators
PDF  484 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

DSPIC33EP128GS708 Datasheet(HTML) 450 Page - Microchip Technology

Back Button DSPIC33EP128GS708 Datasheet HTML 446Page - Microchip Technology DSPIC33EP128GS708 Datasheet HTML 447Page - Microchip Technology DSPIC33EP128GS708 Datasheet HTML 448Page - Microchip Technology DSPIC33EP128GS708 Datasheet HTML 449Page - Microchip Technology DSPIC33EP128GS708 Datasheet HTML 450Page - Microchip Technology DSPIC33EP128GS708 Datasheet HTML 451Page - Microchip Technology DSPIC33EP128GS708 Datasheet HTML 452Page - Microchip Technology DSPIC33EP128GS708 Datasheet HTML 453Page - Microchip Technology DSPIC33EP128GS708 Datasheet HTML 454Page - Microchip Technology Next Button
Zoom Inzoom in Zoom Outzoom out
 450 / 484 page
background image
dsPIC33EPXXXGS70X/80X FAMILY
DS70005258C-page 450
 2016-2018 Microchip Technology Inc.
RECOMMENDED LAND PATTERN
Dimension Limits
Units
C2
Optional Center Pad Width
Contact Pad Spacing
Optional Center Pad Length
Contact Pitch
Y2
X2
4.75
4.75
MILLIMETERS
0.65 BSC
MIN
E
MAX
6.00
Contact Pad Length (X28)
Contact Pad Width (X28)
Y1
X1
0.80
0.35
Microchip Technology Drawing C04-2385B
NOM
SILK SCREEN
C1
Contact Pad Spacing
6.00
Contact Pad to Pad (X28)
G1
0.20
Thermal Via Diameter
V
Thermal Via Pitch
EV
0.33
1.20
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
C2
C1
EV
EV
E
Y2
Y1
G2
G1
ØV
Contact Pad to Center Pad (X28)
G2
0.20
28-Lead Ultra Thin Plastic Quad Flat, No Lead Package (2N) - 6x6x0.55 mm Body [UQFN]
With 4.65x4.65 mm Exposed Pad and Corner Anchors
1
2
28
Y3
Corner Anchor Chamfer (X4)
Corner Anchor (X4)
X4
X3
0.35
1.00
Y4
X3
X4
Corner Anchor Chamfer (X4)
Corner Anchor (X4)
Y4
Y3
0.35
1.00
X1
Note:
Corner anchor pads are not connected internally and are designed as mechanical features when the
package is soldered to the PCB.



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100  ...More


Datasheet Download

Go To PDF Page


Link URL



Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Contact us   |   Privacy Policy   |   Link to Datasheet    |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com