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DSPIC33EP128GS708 Datasheet(PDF) 458 Page - Microchip Technology |
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DSPIC33EP128GS708 Datasheet(HTML) 458 Page - Microchip Technology |
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458 / 484 page ![]() dsPIC33EPXXXGS70X/80X FAMILY DS70005258C-page 458 2016-2018 Microchip Technology Inc. Microchip Technology Drawing C04-103D Sheet 2 of 2 For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Number of Pins Overall Height Terminal Width Overall Width Overall Length Terminal Length Exposed Pad Width Exposed Pad Length Terminal Thickness Pitch Standoff Units Dimension Limits A1 A b D E2 D2 A3 e L E N 0.65 BSC 0.20 REF 6.25 6.25 0.30 0.20 0.80 0.00 0.30 8.00 BSC 0.40 6.45 6.45 0.90 0.02 8.00 BSC MILLIMETERS MIN NOM 44 6.60 6.60 0.50 0.35 1.00 0.05 MAX K- 0.20 - REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. 1. 2. 3. Notes: Pin 1 visual index feature may vary, but must be located within the hatched area. Package is saw singulated Dimensioning and tolerancing per ASME Y14.5M Terminal-to-Exposed-Pad 44-Lead Plastic Quad Flat, No Lead Package (ML) - 8x8 mm Body [QFN or VQFN] |
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