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DSPIC33EP128GS708 Datasheet(PDF) 462 Page - Microchip Technology |
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DSPIC33EP128GS708 Datasheet(HTML) 462 Page - Microchip Technology |
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462 / 484 page  dsPIC33EPXXXGS70X/80X FAMILY DS70005258C-page 462 2016-2018 Microchip Technology Inc. RECOMMENDED LAND PATTERN Dimension Limits Units C2 Contact Pad Spacing Contact Pitch MILLIMETERS 0.50 BSC MIN E MAX 8.40 Contact Pad Length (X48) Contact Pad Width (X48) Y1 X1 1.50 0.30 Microchip Technology Drawing C04-2300-PT Rev A NOM 48-Lead Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [TQFP] C1 C2 E X1 Y1 G C1 Contact Pad Spacing 8.40 Distance Between Pads G 0.20 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 1. 2. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: SILK SCREEN 12 48 |
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