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REF5045 Datasheet(PDF) 59 Page - Texas Instruments |
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REF5045 Datasheet(HTML) 59 Page - Texas Instruments |
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59 / 62 page  www.ti.com PACKAGE OUTLINE C 10X 0.30 0.18 2.55 0.1 10X 0.5 0.3 2X 2 1.05 0.1 8X 0.5 1 MAX 0.05 0.00 B 3.1 2.9 A 3.1 2.9 (0.2) TYP 4X (0.23) VSON - 1 mm max height DRC0010D PLASTIC SMALL OUTLINE - NO LEAD 4218880/A 10/2020 PIN 1 INDEX AREA SEATING PLANE 0.08 C 1 5 6 10 (OPTIONAL) PIN 1 ID 0.1 C A B 0.05 C EXPOSED THERMAL PAD 11 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 3.800 |
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