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REF5045 Datasheet(PDF) 60 Page - Texas Instruments |
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REF5045 Datasheet(HTML) 60 Page - Texas Instruments |
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60 / 62 page  www.ti.com EXAMPLE BOARD LAYOUT ( 0.2) VIA TYP (1.025) 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND (1.05) 8X (0.5) (2.8) 10X (0.24) 10X (0.6) (2.55) (R0.05) TYP VSON - 1 mm max height DRC0010D PLASTIC SMALL OUTLINE - NO LEAD 4218880/A 10/2020 SYMM 1 5 6 10 SYMM LAND PATTERN EXAMPLE SCALE:20X 11 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If some or all are implemented, recommended via locations are shown. SOLDER MASK OPENING SOLDER MASK METAL UNDER SOLDER MASK DEFINED METAL SOLDER MASK OPENING SOLDER MASK DETAILS NON SOLDER MASK DEFINED (PREFERRED) |
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