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REF5045 Datasheet(PDF) 7 Page - Texas Instruments |
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REF5045 Datasheet(HTML) 7 Page - Texas Instruments |
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7 / 62 page ![]() 7 ADS8881 www.ti.com SBAS547D – MAY 2013 – REVISED AUGUST 2015 Product Folder Links: ADS8881 Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 8 Specifications 8.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT AINP to GND or AINN to GND –0.3 REF + 0.3 V AVDD to GND or DVDD to GND –0.3 4 V REF to GND –0.3 5.7 V Digital input voltage to GND –0.3 DVDD + 0.3 V Digital output to GND –0.3 DVDD + 0.3 V Operating temperature, TA ADS8881C 0 70 °C ADS8881I –40 85 Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 8.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22- C101(2) ±500 8.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT AVDD Analog power supply 3 V DVDD Digital power supply 3 V VREF Reference voltage 5 V 8.4 Thermal Information THERMAL METRIC ADS8881 UNIT DGS (VSSOP) DRC (VSON) 10 PINS 10 PINS RθJA Junction-to-ambient thermal resistance 151.9 111.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 45.4 46.4 °C/W RθJB Junction-to-board thermal resistance 72.2 45.9 °C/W ψJT Junction-to-top characterization parameter 3.3 3.5 °C/W ψJB Junction-to-board characterization parameter 70.9 45.5 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W |
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