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R5F10366ASP Datasheet(PDF) 89 Page - Renesas Technology Corp

Part # R5F10366ASP
Description  True low-power platform (63 μA/MHz) for the general-purpose applications, with 1.8-V to 5.5-V operation, 2- to 16-Kbyte code flash memory, and 31 DMIPS at 24 MHz
PDF  114 Pages
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Manufacturer  RENESAS [Renesas Technology Corp]
Direct Link  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

R5F10366ASP Datasheet(HTML) 89 Page - Renesas Technology Corp

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RL78/G12
3. ELECTRICAL SPECIFICATIONS (G: INDUSTRIAL APPLICATIONS TA = –40 to +105°C)
R01DS0193EJ0250 Rev.2.50
Jan 17, 2025
Page 89 of 109
(7) Communication at different potential (1.8 V, 2.5 V, 3 V) (simplified SPI (CSI) mode) (slave mode, SCKp... external
clock input)
(TA = –40 to +105°C, 2.4 V ≤ VDD ≤ 5.5 V, VSS = 0 V)
Parameter
Symbol
Conditions
HS (high-speed main)
Mode
Unit
MIN.
MAX.
SCKp cycle time Note 1
tKCY2
4.0 V
≤ VDD ≤ 5.5 V,
2.7 V
≤ Vb ≤ 4.0 V
20 MHz < fMCK
≤ 24 MHz
24/fMCK
ns
8 MHz < fMCK
≤ 20 MHz
20/fMCK
ns
4 MHz < fMCK
≤ 8 MHz
16/fMCK
ns
fMCK
≤ 4 MHz
12/fMCK
ns
2.7 V
≤ VDD < 4.0 V,
2.3 V
≤ Vb ≤ 2.7 V
20 MHz < fMCK
≤ 24 MHz
32/fMCK
ns
16 MHz < fMCK
≤ 20 MHz
28/fMCK
ns
8 MHz < fMCK
≤ 16 MHz
24/fMCK
ns
4 MHz < fMCK
≤ 8 MHz
16/fMCK
ns
fMCK
≤ 4 MHz
12/fMCK
ns
2.4 V
≤ VDD < 3.3 V,
1.6 V
≤ Vb ≤ 2.0 V
20 MHz < fMCK
≤ 24 MHz
72/fMCK
ns
16 MHz < fMCK
≤ 20 MHz
64/fMCK
ns
8 MHz < fMCK
≤ 16 MHz
52/fMCK
ns
4 MHz < fMCK
≤ 8 MHz
32/fMCK
ns
fMCK
≤ 4 MHz
20/fMCK
ns
SCKp high-/low-level
width
tKH2,
tKL2
4.0 V
≤ VDD ≤ 5.5 V, 2.7 V ≤ Vb ≤ 4.0 V
tKCY2/2 – 24
ns
2.7 V
≤ VDD < 4.0 V, 2.3 V ≤ Vb ≤ 2.7 V
tKCY2/2 – 36
ns
2.4 V
≤ VDD < 3.3 V, 1.6 V ≤ Vb ≤ 2.0 V
tKCY2/2 – 100
ns
SIp setup time
(to SCKp
↑) Note 2
tSIK2
4.0 V
≤ VDD ≤ 5.5 V, 2.7 V ≤ VDD ≤ 4.0 V
1/fMCK + 40
ns
2.7 V
≤ VDD < 4.0 V, 2.3 V ≤ Vb ≤ 2.7 V
1/fMCK + 40
ns
2.4 V
≤ VDD < 3.3 V, 1.6 V ≤ VDD ≤ 2.0 V
1/fMCK + 60
ns
SIp hold time
(from SCKp
↑) Note 3
tKSI2
1/fMCK + 62
ns
Delay time from SCKp
↓ to
SOp output Note 4
tKSO2
4.0 V
≤ VDD ≤ 5.5 V, 2.7 V ≤ Vb ≤ 4.0 V,
Cb = 30 pF, Rb = 1.4 k
Ω
2/fMCK +
240
ns
2.7 V
≤ VDD < 4.0 V, 2.3 V ≤ Vb ≤ 2.7 V,
Cb = 30 pF, Rb = 2.7 k
Ω
2/fMCK +
428
ns
2.4 V
≤ VDD < 3.3 V, 1.6 V ≤ Vb ≤ 2.0 V,
Cb = 30 pF, Rb = 5.5 k
Ω
2/fMCK +
1146
ns
Notes 1.
Transfer rate in the SNOOZE mode: MAX. 1 Mbps
2.
When DAPmn = 0 and CKPmn = 0, or DAPmn = 1 and CKPmn = 1. The SIp setup time becomes “to
SCKp
↓” when DAPmn = 0 and CKPmn = 1, or DAPmn = 1 and CKPmn = 0.
3.
When DAPmn = 0 and CKPmn = 0, or DAPmn = 1 and CKPmn = 1. The SIp hold time becomes “from
SCKp
↓” when DAPmn = 0 and CKPmn = 1, or DAPmn = 1 and CKPmn = 0.
4.
When DAPmn = 0 and CKPmn = 0, or DAPmn = 1 and CKPmn = 1. The delay time to SOp output
becomes “from SCKp
↑” when DAPmn = 0 and CKPmn = 1, or DAPmn = 1 and CKPmn = 0.
Cautions 1. Select the TTL input buffer for the SIp and SCKp pins and the N-ch open drain output (VDD
tolerance) mode for the SOp pin by using port input mode register 1 (PIM1) and port output
mode register 1 (POM1). For VIH and VIL, see the DC characteristics with TTL input buffer
selected.
2. CSI01 and CSI11 cannot communicate at different potential.



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