R5F10366ASP datasheet(1/114 Pages) RENESAS

Part #	R5F10366ASP

Description	True low-power platform (63 μA/MHz) for the general-purpose applications, with 1.8-V to 5.5-V operation, 2- to 16-Kbyte code flash memory, and 31 DMIPS at 24 MHz

PDF	114 Pages

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Manufacturer	RENESAS [Renesas Technology Corp]

Direct Link	http://www.renesas.com

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Datasheet

RL78/G12

RENESAS MCU

True low-power platform (63

μA/MHz) for the general-purpose applications, with 1.8-V to 5.5-V operation,

2- to 16-Kbyte code flash memory, and 31 DMIPS at 24 MHz

R01DS0193EJ0250 Rev.2.50

Jan 17, 2025

Page 1 of 109

R01DS0193EJ0250

Rev.2.50

Jan 17, 2025

1. OUTLINE

1.1 Features

Ultra-low power consumption technology

 VDD = single power supply voltage of 1.8 to 5.5 V which

can operate at a low voltage

 HALT mode

 STOP mode

 SNOOZE mode

RL78 CPU core

 CISC architecture with 3-stage pipeline

 Minimum instruction execution time: Can be changed

from high speed (0.04167

s: @ 24 MHz operation with

high-speed on-chip oscillator) to ultra-low speed (1

s:

@ 1 MHz operation)

 Address space: 1 MB

 General-purpose registers: (8-bit register x 8) x 4 banks

 On-chip RAM: 256 B to 2 KB

Code flash memory

 Code flash memory: 2 to 16 KB

 Block size: 1 KB

 Prohibition of block erase and rewriting (security

function)

 On-chip debug function

 Self-programming (with flash shield window function)

Data flash memory Note2

 Data flash memory: 2 KB

 Back ground operation (BGO): Instructions are

executed from the program memory while rewriting the

data flash memory.

 Number of rewrites: 1,000,000 times (TYP.)

 Voltage of rewrites: VDD = 1.8 to 5.5 V

High-speed on-chip oscillator

 Select from 24 MHz, 16 MHz, 12 MHz, 8 MHz, 6 MHz,

4 MHz, 3 MHz, 2 MHz, and 1 MHz

 High accuracy: +/- 1.0 % (VDD = 1.8 to 5.5 V, TA = -20

to +85 °C)

Operating ambient temperature

 TA = -40 to +85 °C (A: Consumer applications, D:

Industrial applications)

 TA = -40 to +105 °C (G: Industrial applications) Note2

Power management and reset function

 On-chip power-on-reset (POR) circuit

 On-chip voltage detector (LVD) (Select interrupt and

reset from 12 levels)

DMA (Direct Memory Access) controller Note2

 2 channels

 Number of clocks during transfer between 8/16-bit SFR

and internal RAM: 2 clocks

Multiplier and divider/multiply-accumulator

 16 bits x 16 bits = 32 bits (Unsigned or signed)

 32 bits x 32 bits = 32 bits (Unsigned)

 16 bits x 16 bits + 32 bits = 32 bits (Unsigned or

signed)

Serial interface

 Simplified SPI (CSI Note1):

: 1 to 3 channels

 UART

: 1 to 3 channels

 Simplified I2C communication

: 0 to 3 channels

 I2C communication

: 1 channel

Timer

 16-bit timer

: 4 to 8 channels

 12-bit interval timer : 1 channel

 Watchdog timer

: 1 channel (operable with the

dedicated low-speed on-chip

oscillator)

A/D converter

 8/10-bit resolution A/D converter (VDD = 1.8 to 5.5 V)

 8 to 11 channels, internal reference voltage (1.45 V),

and temperature sensor Note2

I/O port

 I/O port: 18 to 26

(N-ch open drain I/O [withstand voltage of 6 V]: 2,

N-ch open drain I/O [VDD withstand voltage]: 4 to 9)

 Can be set to N-ch open drain, TTL input buffer, and

on-chip pull-up resistor

 Different potential interface: Can connect to a 1.8/2.5/3

V device

 On-chip key interrupt function

 On-chip clock output/buzzer output controller

Others

 On-chip BCD (binary-coded decimal) correction circuit

Note 1. Although the CSI function is generally called SPI,

it is also called CSI in this product, so it is referred

to as such in this manual.

Note 2. Can be selected only in HS (high-speed main)

mode.

Remark The functions mounted depend on the product.

See 1.7 Outline of Functions.

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