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6402 Datasheet(PDF) 35 Page - Intel Corporation

Part # 6402
Description  Advanced Memory Buffer
PDF  250 Pages
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Manufacturer  INTEL [Intel Corporation]
Direct Link  http://www.intel.com
Logo INTEL - Intel Corporation

6402 Datasheet(HTML) 35 Page - Intel Corporation

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Intel® 6400/6402 Advanced Memory Buffer Datasheet
35
DDR Interface
3.9
DIMM Organization
The AMB supports DIMMs with 1 or 2 independent ranks (chip-selects). Each rank
consists of DDR SDRAM devices or DDR SDRAM devices. Dual rank DIMMs consist of
DDR SDRAM devices or DDR SDRAM devices.
The AMB DDR I/O circuits provide three main functions: an outbound command and
data path, an inbound data path, and analog compensation.
Analog compensation is provided, along with configuration registers, to control and
match the output impedance and slew rate of the off-chip drivers and on on-die
termination. The main configuration registers are the leg override (for impedance) and
slew override fields of the spdpar67cur and spdpar1011cur CSR’s. The analog
compensation circuits match driver characteristics to a ratio of an externally provided
resistance. The CSR’s control the ratio.
The outbound data path is relatively simple compared to the inbound. On the outbound
command, the I/O circuits provide a minimum latency, registered path to transfer
commands from the core to the DDR command bus as quickly as possible, but with
tight timing control. For the DQ, DQS, and DRAM clock outputs, the I/O provides
registered paths to transfer these signals to the DDR bus with the proper phase
relationship to the command. The phase of the DRAM clocks (along with the DQS and
DQ phase) relative to the command can be controlled by the ddr1xphsel and ca2xphsel
fields of the spdpar45cur and spdpar67cur CSR’s.
The inbound data path includes calibrated receiver enable circuits, calibrated DQS delay
lines, and an eight entry deep levelization FIFO. Calibration is controlled by the core at
power up and can take several ms to execute. Calibration involves a series of read and
write operations to the DRAM. Receiver enable is calibrated on a per byte basis. DQS
delay is calibrated at a coarse level on a word basis, with a fine calibration adjustment
for each nibble. The fine adjustment can be dynamic so that a different calibration
value can be sent from the core for each nibble depending on which rank is being
accessed. The core provides a read pointer to access the contents of the FIFO. The IO
I/O circuits manage the FIFO write pointer automatically, with timing based on both the
receiver enable and DQS delay calibrations.
§



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