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6402 Datasheet(PDF) 51 Page - Intel Corporation |
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6402 Datasheet(HTML) 51 Page - Intel Corporation |
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51 / 250 page ![]() Intel® 6400/6402 Advanced Memory Buffer Datasheet 51 Electrical, Power, and Thermal 4.4.12 Reference DDR2 Interface Package Trace Lengths The following reference package trace lengths have been incorporated into the Advance Memory Buffer timings in Table 4-9. 4.5 SMBUS Interface Note: Based on High-power SMBus DC Specification 4.6 Miscellaneous I/O (1.5 Volt CMOS Driver) 4.7 Thermal Diode and Analog to Digital Converter (ADC) A thermal diode with an analog to digital converter (ADC) is required. The thermal sensor will be used to ensure prevention of catastrophic failure. Table 4-9. Advance Memory Buffer DDR2 Package Lengths Signal Group Min Length Max Length Units CLK/CLK 24 26 mm Command/Address 4 20 mm CKE, CS# 9 22 mm ODT 10 16 mm DQS/DQS/DQ 9 13 mm Table 4-10. Recommended Operating Conditions for SMBUS Interface Symbol Parameter Min Typ Max Unit Comments VDDSPD Supply voltage (SMBUS) 3.0 3.3 3.6 V 3.3v +10% VIL SMBus signal input low voltage - - 0.8 V VIH SMBus signal input high voltage 2.1 - VDDSPD V VOL SMBus signal output low voltage - - 0.4 V @IPULLUP ILEAK-BUS Input Leakage per bus segment - - +200 µA ILEAK-PIN Input Leakage per device pin - - +10 µA IPULLUP Current sinking, VOL = 0.4V 4 - - mA CBUS Capacitive load per bus segment - - 400 pF CI Capacitance for SMBDAT or SMBCLK pin -- 10 pF VNOISE Signal noise immunity from 10MHz to 100MHz 300 - - mV p-p This is AC item applies to the high-power DC specification only Table 4-11. Recommended Operating Conditions for RESET and BFUNC Pins Symbol Parameter Min Typ Max Unit Comments VIH(dc) DC HIGH-level input voltage 1.0 - - V VIL(dc) DC LOW-level input voltage - - 0.5 V ILEAK Input leakage - - + 90 µA |
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