GRM552B11H102KA01D datasheet(141/221 Pages) MURATA

141 / 221 page

!Caution

5. Optimum Solder Amount for Flow Soldering

5-1. The top of the solder fillet should be lower than the

thickness of components. If the solder amount is

excessive, the risk of cracking is higher during board

bending or any other stressful condition.

GRM18/21/31

LLL21/31

GQM18/21

∆TV150°C

Part Number

Temperature Differential

Table 2

[Standard Conditions for Flow Soldering]

[Allowable Flow Soldering Temperature and Time]

In a case of repeated soldering, the accumulated

soldering time must be within the range shown above.

,,,

Soldering Time (sec.)

260

270

280

250

240

230

220

010

Up to Chip Thickness

Adhesive

Continued from the preceding page.

Continued on the following page.

Recommended Conditions

Soldering Peak Temperature

Atmosphere

Pb-Sn Solder

240 to 250

°C

Air

Lead Free Solder

250 to 260

°C

Preheating Peak Temperature

90 to 110

°C

100 to 120

°C

30-90 seconds

5 seconds max.

∆T

Gradual

Cooling

Soldering

Preheating

Peak

Temperature

Time

Temperature (

Soldering

Peak

Temperature

Pb-Sn Solder: Sn-37Pb

Lead Free Solder: Sn-3.0Ag-0.5Cu

4-2. Flow Soldering

1. When sudden heat is applied to the components, the

mechanical strength of the components will decrease

because a sudden temperature change causes

deformation inside the components. In order to prevent

mechanical damage in the components, preheating

should be required for both of the components and the

PCB board.

Preheating conditions are shown in table 2. It is required

to keep the temperature differential between the solder

and the component's surface (

∆T) as small as possible.

2. Excessively long soldering time or high soldering

temperature can result in leaching of the outer electrodes,

causing poor adhesion or a reduction in capacitance

value due to loss of contact between electrodes and end

termination.

3. When components are immersed in solvent after

mounting, be sure to maintain the temperature difference

(

∆T) between the component and solvent within the range

shown in the table 2.

4. Do not apply flow soldering to chips not listed in table 2.

,,,,

in section

!Caution

139

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our

sales representatives or product engineers before ordering.

• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

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10.12.20

GRM552B11H102KA01D Datasheet(PDF) 141 Page - Murata Manufacturing Co., Ltd.

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