GRM552B11H102KA01D datasheet(142/221 Pages) MURATA

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!Caution

Solder Amount

in section

4-3. Correction with a Soldering Iron

1. When sudden heat is applied to the components when

using a soldering iron, the mechanical strength of the

components will decrease because the extreme

temperature change can cause deformations inside the

components. In order to prevent mechanical damage to

the components, preheating is required for both the

components and the PCB board. Preheating conditions,

(The "Temperature of the Soldering Iron Tip", "Preheating

Temperature," "Temperature Differential" between the

iron tip and the components and the PCB), should be

within the conditions of table 3. It is required to keep the

temperature differential between the soldering iron and

the component surfaces (

∆T) as small as possible.

2. After soldering, do not allow the component/PCB to

rapidly cool down.

3. The operating time for the re-working should be as short

as possible. When re-working time is too long, it may

cause solder leaching, in turn causing a reduction in the

adhesive strength of the terminations.

4. Optimum Solder amount when re-working with a

Soldering lron

4-1. For sizes smaller than 0603, (GRM03/15/18,

GJM03/15, GQM18), the top of the solder fillet

should be lower than 2/3's of the thickness of the

component or 0.5mm whichever is smaller. For 0805

and larger sizes, (GRM21/31/32/43/55, GQM21/22),

the top of the solder fillet should be lower than 2/3's

of the thickness of the component. If the solder

amount is excessive, the risk of cracking is higher

during board bending or under any other stressful

condition.

4-2. A soldering iron with a tip of ø3mm or smaller should

be used. It is also necessary to keep the soldering

iron from touching the components during the

re-work.

4-3. Solder wire with ø0.5mm or smaller is required for

soldering.

GRM03/15/18/21/31

GJM03/15

GQM18/21

GRM32/43/55

GQM22

∆TV190°C

∆TV130°C

Part Number

Temperature

Differential

(

∆T)

Table 3

Continued from the preceding page.

4-4. Leaded Component Insertion

1. If the PCB is flexed when leaded components (such as

transformers and ICs) are being mounted, chips may

crack and solder joints may break.

Before mounting leaded components, support the PCB

using backup pins or special jigs to prevent warping.

5. Washing

Excessive ultrasonic oscillation during cleaning can cause

the PCBs to resonate, resulting in cracked chips or broken

solder joints. Take note not to vibrate PCBs.

Air

Atmosphere

350

°C max.

280

°C max.

Temperature

of Soldering

Iron Tip

150

°C min.

150

°C min.

Preheating

Temperature

*Applicable for both Pb-Sn and Lead Free Solder.

Pb-Sn Solder: Sn-37Pb

Lead Free Solder: Sn-3.0Ag-0.5Cu

Continued on the following page.

!Caution

140

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our

sales representatives or product engineers before ordering.

• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

C02E.pdf

10.12.20

GRM552B11H102KA01D Datasheet(PDF) 142 Page - Murata Manufacturing Co., Ltd.

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