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GRM552B11H102KA01D Datasheet(PDF) 151 Page - Murata Manufacturing Co., Ltd.

Part # GRM552B11H102KA01D
Description  Chip Monolithic Ceramic Capacitors
PDF  221 Pages
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Manufacturer  MURATA [Murata Manufacturing Co., Ltd.]
Direct Link  http://www.murata.com
Logo MURATA - Murata Manufacturing Co., Ltd.

GRM552B11H102KA01D Datasheet(HTML) 151 Page - Murata Manufacturing Co., Ltd.

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Notice
1. A crack may be caused in the capacitor due to the stress
of the thermal contraction of the resin during curing
process.
The stress is affected by the amount of resin and curing
contraction.
Select a resin with small curing contraction.
The difference in the thermal expansion coefficient
between a coating resin or a molding resin and the
capacitor may cause the destruction and deterioration of
the capacitor such as a crack or peeling, and lead to the
deterioration of insulation resistance or dielectric
breakdown.
Select a resin for which the thermal expansion coefficient
is as close to that of capacitor as possible.
A silicone resin can be used as an under-coating to buffer
against the stress.
2. Select a resin that is less hygroscopic.
Using hygroscopic resins under high humidity conditions
may cause the deterioration of the insulation resistance of
a capacitor.
An epoxy resin can be used as a less hygroscopic resin.
7. Coating
1. Die Bonding of Capacitors
• Use the following materials for the Brazing alloys:
Au-Sn (80/20) 300 to 320
°C in N2 atmosphere
• Mounting
(1) Control the temperature of the substrate so it
matches the temperature of the brazing alloy.
(2) Place the brazing alloy on the substrate and place
the capacitor on the alloy. Hold the capacitor and
gently apply the load. Be sure to complete the
operation within 1 minute.
2. Wire Bonding
• Wire
Gold wire: 25 micro m (0.001 inch) diameter
• Bonding
(1) Thermo compression, ultrasonic ball bonding.
(2) Required stage temperature: 150 to 200
°C
(3) Required wedge or capillary weight: 0.2N to 0.5N
(4) Bond the capacitor and base substrate or other
devices with gold wire.
8. Die Bonding/Wire Bonding (GMA or GMD Series)
Continued from the preceding page.
Notice
149
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
C02E.pdf
10.12.20



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