TNETV1647GSTZWT datasheet(92/236 Pages) TI1

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TMS320DM6441

SPRS359E – SEPTEMBER 2006 – REVISED AUGUST 2010

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5.3

Electrical Characteristics Over Recommended Ranges of Supply Voltage and

Operating Case Temperature (Unless Otherwise Noted)

PARAMETER

TEST CONDITIONS (1)

MIN

TYP

MAX

UNIT

Low/full speed: USB_DN and USB_DP

2.8

USB_DVDDAP3

High speed: USB_DN and USB_DP

360

440

VOH

High-level output voltage (3.3V I/O)

DVDD33 = MIN, IOH = MAX

2.4

High-level output voltage (1.8V I/O)

DVDD18 = MIN, IOH = MAX

DVDD - 0.45

Low/full speed: USB_DN and USB_DP

0.0

0.3

High speed: USB_DN and USB_DP

-10

VOL

Low-level output voltage (3.3V I/O)

DVDD33 = MIN, IOL = MAX

0.4

Low-level output voltage (1.8V I/O)

DVDD18 = MIN, IOL = MAX

0.45

VI = VSS to DVDD without opposing

±10

µA

internal resistor

VI = VSS to DVDD with opposing internal

(2)

Input current

100

250

µA

pullup resistor (3)

VI = VSS to DVDD with opposing internal

-250

-100

-50

µA

pulldown resistor (3)

IOH

High-level output current

All peripherals

IOL

Low-level output current

All peripherals

VO = DVDD or VSS, internal pull disabled

±20

IOZ

(4)

I/O Off-state output current

µA

VO = DVDD or VSS, internal pull enabled

±100

CVDD = 1.2 V, DSP clock = 513 MHz

659

Core (CVDD, APLLREFV, VDDA_1P1V,

ICDD

VDDA1P2LDO

(5), CV

DDDSP) supply current

(6)

CVDD = 1.05 V, DSP clock = 405 MHz

521

DVDD = 3.3 V, DSP clock = 513 MHz

3.3V I/O (DVDD33, USB_DVDDA3P3) supply

IDDD

current(6)

DVDD = 3.3 V, DSP clock = 405 MHz

1.8V I/O (DVDD18, DVDDR2, DDR_VDDDLL,

DVDD = 1.8 V, DSP clock = 513 MHz

IDDD

PLLVDD18, VDDA_1P8V, USB_VDD1P8,

DVDD = 1.8 V, DSP clock = 405 MHz

MXVDD, M24VDD) supply current(6)

Input capacitance

Output capacitance

(1)

For test conditions shown as MIN, MAX, or NOM, use the appropriate value specified in Section 5.2, Recommended Operating

Conditions.

(2)

II applies to input-only pins and bi-directional pins. For input-only pins, II indicates the input leakage current. For bi-directional pins, II

indicates the input leakage current and off-state (Hi-Z) output leakage current.

(3)

Applies only to pins with an internal pullup (IPU) or pulldown (IPD) resistor.

(4)

IOZ applies to output-only pins, indicating off-state (Hi-Z) output leakage current.

(5)

This pin is an internal LDO output and connected via 1 µF capacitor to USB_VSSA1P2LDO.

(6)

Measured under the following conditions: 60% DSP CPU utilization; ARM doing typical activity (peripheral configurations, other

housekeeping activities); DDR2 Memory Controller at 50% utilization (135 MHz), 50% writes, 32 bits, 50% bit switching; 2 MHz ASP at

100% utilization; Timer0 at 100% utilization. At room temperature (25°C) for typical process devices. The actual current draw varies

across manufacturing processes and is highly application-dependent. For more details on core and I/O activity, as well as information

relevant to board power supply design, see the TMS320DM6441 Power Consumption Summary application report (literature number

SPRAAU3).

Device Operating Conditions

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