FS32R274VBK2MMM datasheet(3/78 Pages) NXP

3 / 78 page

Table of Contents

1 Introduction........................................................................................ 4

1.1

Family comparison..................................................................4

1.2

Feature list............................................................................... 5

1.3

Block diagram......................................................................... 9

2 Ordering parts.....................................................................................9

2.1

Determining valid orderable parts...........................................9

3 Part identification............................................................................... 10

3.1

Description.............................................................................. 10

3.2

Fields....................................................................................... 10

4 General............................................................................................... 11

4.1

Absolute maximum ratings..................................................... 11

4.2

Operating conditions............................................................... 13

4.3

Supply current characteristics................................................. 15

4.4

Voltage regulator electrical characteristics............................. 16

4.5

Electromagnetic Compatibility (EMC) specifications............ 20

4.6

Electrostatic discharge (ESD) characteristics......................... 20

5 I/O Parameters....................................................................................21

5.1

I/O pad DC electrical characteristics ......................................21

5.2

I/O pad AC specifications....................................................... 22

5.3

Aurora LVDS driver electrical characteristics........................ 23

5.4

Reset pad electrical characteristics..........................................24

6 Peripheral operating requirements and behaviours............................ 26

6.1

Clocks and PLL Specifications............................................... 26

7 Analog modules................................................................................. 29

7.1

ADC electrical characteristics.................................................29

7.2

Sigma Delta ADC electrical characteristics............................ 33

7.3

DAC electrical specifications..................................................36

8 Memory modules............................................................................... 37

8.1

Flash memory program and erase specifications.................... 37

8.2

Flash memory Array Integrity and Margin Read

specifications...........................................................................38

8.3

Flash memory module life specifications................................38

8.4

Data retention vs program/erase cycles...................................39

8.5

Flash memory AC timing specifications.................................39

8.6

Flash memory read wait-state and address-pipeline control

settings.....................................................................................40

9 Communication modules................................................................... 41

9.1

Ethernet switching specifications............................................41

9.2

FlexRay timing parameters..................................................... 46

9.3

LVDS Fast Asynchronous Transmission (LFAST) electrical

characteristics.......................................................................... 49

9.4

Serial Peripheral Interface (SPI) timing specifications........... 53

9.5

LINFlexD timing specifications..............................................58

9.6

I2C timing .............................................................................. 58

10 Debug modules...................................................................................59

10.1 JTAG/CJTAG interface timing .............................................. 59

10.2 Nexus Aurora debug port timing.............................................62

11 WKUP/NMI timing specifications.....................................................63

12 External interrupt timing (IRQ pin)................................................... 64

13 Temperature sensor electrical characteristics.....................................64

14 Radar module..................................................................................... 65

14.1 MIPICSI2 D-PHY electrical and timing specifications.......... 65

14.2 MIPICSI2 Disclaimer..............................................................68

15 Thermal Specifications.......................................................................70

15.1 Thermal characteristics........................................................... 70

16 Packaging........................................................................................... 72

17 Reset sequence................................................................................... 72

17.1 Reset sequence duration.......................................................... 73

17.2 Reset sequence description......................................................73

18 Power sequencing requirements.........................................................75

19 Pinouts................................................................................................76

19.1 Package pinouts and signal descriptions................................. 76

20 Revision History.................................................................................76

S32R274/S32R264 Series Data Sheet, Rev. 6, 06/2021

NXP Semiconductors

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