FS32R274VBK2MMM datasheet(37/78 Pages) NXP

37 / 78 page

7. DAC PSRR is 30 dB minimum for DAC output levels of 1/3 of full-scale or less. DAC PSRR is 24 dB minimum with the

DAC output at full-scale.

Memory modules

8.1 Flash memory program and erase specifications

NOTE

All timing, voltage, and current numbers specified in this

section are defined for a single embedded flash memory within

an SoC, and represent average currents for given supplies and

operations.

Table 28 shows the estimated Program/Erase times.

Table 28. Flash memory program and erase specifications

Symbol

Characteristic1

Typ2

Factory

Programming3, 4

Field Update

Unit

Initial

Max

Initial

Max, Full

Temp

Typical

End of

Life5

Lifetime Max6

20°C ≤TA

≤30°C

-40°C ≤TJ

≤150°C

-40°C ≤TJ

≤150°C

≤ 1,000

cycles

≤ 250,000

cycles

tdwpgm

Doubleword (64 bits) program time 43

100

150

500

μs

tppgm

Page (256 bits) program time

200

300

108

500

μs

tqppgm

Quad-page (1024 bits) program

time

268

800

1,200

396

2,000

μs

t16kers

16 KB Block erase time

168

290

320

250

1,000

t16kpgm

16 KB Block program time

1,000

t32kers

32 KB Block erase time

217

360

390

310

1,200

t32kpgm

32 KB Block program time

100

110

1,200

t64kers

64 KB Block erase time

315

490

590

420

1,600

t64kpgm

64 KB Block program time

138

180

210

170

1,600

t256kers

256 KB Block erase time

884

1,520

2,030

1,080

4,000

—

t256kpgm

256 KB Block program time

552

720

880

650

4,000

—

1. Program times are actual hardware programming times and do not include software overhead. Block program times

assume quad-page programming.

2. Typical program and erase times represent the median performance and assume nominal supply values and operation at

25 °C. Typical program and erase times may be used for throughput calculations.

3. Conditions: ≤ 150 cycles, nominal voltage.

4. Plant Programing times provide guidance for timeout limits used in the factory.

5. Typical End of Life program and erase times represent the median performance and assume nominal supply values.

Typical End of Life program and erase values may be used for throughput calculations.

6. Conditions: -40°C ≤ TJ ≤ 150°C, full spec voltage.

Memory modules

S32R274/S32R264 Series Data Sheet, Rev. 6, 06/2021

NXP Semiconductors

FS32R274VBK2MMM Datasheet(PDF) 37 Page - NXP Semiconductors

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