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THVD2452VDREP Datasheet(PDF) 5 Page - Texas Instruments

Part # THVD2452VDREP
Description  THVD24xxV-EP Enhanced 3V to 5.5V RS-485 Transceivers With 1.8V VIO Capability
PDF  40 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

THVD2452VDREP Datasheet(HTML) 5 Page - Texas Instruments

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5.4 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VCC
Supply voltage
3
5.5
V
VIO
I/O supply voltage
1.65
VCC
V
VI
Input voltage at any bus terminal (separately or common mode)(1)
–12
12
V
VIH
High-level input voltage (driver, driver enable, receiver enable and slew rate select
inputs)
0.7*VIO
VIO
V
VIL
Low-level input voltage (driver, driver enable, receiver enable and slew rate select
inputs)
0
0.3*VIO
V
VID
Differential input voltage bus pins
–25
25
V
IO
Output current, driver
–60
60
mA
IOR
Output current, receiver
VIO = 1.8 V or 2.5 V
–4
4
mA
IOR
Output current, receiver
VIO = 3.3 V or 5 V
–8
8
mA
RL
Differential load resistance
54
60
Ω
1/tUI
Signaling rate
THVD2410V, THVD2412V with SLR = VIO
250
kbps
THVD2410V, THVD2412V with SLR = GND
or floating
1
Mbps
THVD2450V, THVD2452V with SLR = VIO
20
Mbps
THVD2450V, THVD2452V with SLR = GND
or floating
50
Mbps
TA
Operating ambient temperature
-55
125
°C
TJ
Junction temperature
-55
150
°C
(1)
The algebraic convention, in which the least positive (most negative) limit is designated as minimum is used in this data sheet.
5.5 Thermal Information
THERMAL METRIC(1)
THVD2410V-EP
THVD2450V-EP
THVD2452V-EP
UNIT
DRC
(VSON)
D
(SOIC)
10 PINS
14 PINS
RθJA
Junction-to-ambient thermal resistance
46.7
87.5
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
47.7
41.8
°C/W
RθJB
Junction-to-board thermal resistance
19.1
43.7
°C/W
ψJT
Junction-to-top characterization parameter
0.7
8.1
°C/W
ψJB
Junction-to-board characterization parameter
19.1
43.3
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
4.6
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
www.ti.com
THVD2410V-EP, THVD2450V-EP, THVD2452V-EP
SLLSFQ9B – MAY 2024 – REVISED OCTOBER 2024
Copyright © 2024 Texas Instruments Incorporated
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Product Folder Links: THVD2410V-EP THVD2450V-EP THVD2452V-EP



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