ADS8699IPWR datasheet(5/74 Pages) TI2

5 / 74 page

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

AIN_P, AIN_GND to GND

AVDD = 5 V(2)

–20

AVDD = floating(3)

–15

AVDD to GND or DVDD to GND

–0.3

REFCAP to REFGND or REFIO to REFGND

–0.3

5.7

GND to REFGND

–0.3

0.3

Digital input pins to GND

–0.3

DVDD + 0.3

Digital output pins to GND

–0.3

DVDD + 0.3

Temperature

Operating, TA

–40

125

°C

Storage, Tstg

–65

150

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

AVDD = 5 V.

(3)

AVDD = floating.

6.2 ESD Ratings

VALUE

UNIT

V(ESD) Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

Analog input pins

(AIN_P, AIN_GND)

±4000

All other pins

±2000

Charged device model (CDM), per JEDEC specification JESD22-C101(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

AVDD

Analog supply voltage

4.75

5.25

DVDD

Digital supply voltage

1.65

3.3

AVDD

6.4 Thermal Information

THERMAL METRIC(1)

ADS8691,

ADS8695,

ADS8699

UNIT

PW (TSSOP)

16 PINS

RθJA

Junction-to-ambient thermal resistance

95.7

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

29.3

°C/W

RθJB

Junction-to-board thermal resistance

41.5

°C/W

ψJT

Junction-to-top characterization parameter

1.5

°C/W

ψJB

Junction-to-board characterization parameter

40.8

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

www.ti.com

ADS8691, ADS8695, ADS8699

SBAS777B – DECEMBER 2016 – REVISED MARCH 2021

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Product Folder Links: ADS8691 ADS8695 ADS8699

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